Service Reference Guide, dc5750
437963-001
7–17
Removal and Replacement Procedures— Small Form Factor (SFF) Chassis
7.8 Memory
Ä
CAUTION:
The memory module sockets have gold metal contacts. When upgrading the memory, it is
important to use memory modules with gold metal contacts to prevent corrosion and/or oxidation
resulting from having incompatible metals in contact with each other.
Ä
CAUTION:
Static electricity can damage the electronic components of the computer or optional cards.
Before beginning these procedures, ensure that you are discharged of static electricity by briefly touching
a grounded metal object. Refer to
Section 5.2, “Electrostatic Discharge Information”
for more information.
Ä
CAUTION:
When handling a memory module, be careful not to touch any of the contacts. Doing so
may damage the module.
1. Prepare the computer for disassembly (
Section 7.1
).
2. Remove the access panel(
Section 7.3
).
3. Remove the front bezel (
Section 7.4
).
4. Remove the ODD (
Section 7.7.2
).
Å
WARNING:
To reduce risk of personal injury from hot surfaces, allow the internal system components to
cool before touching.
5. Rotate the optical drive retainer to its upright position to access the memory module sockets.
6. Open both latches of the memory module socket
1
, and insert the memory module into the
socket
2
. Refer to
Appendix F, “Memory”
for the correct sequence for installing memory
modules to get optimal performance.
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