EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at
Item Description
Notes
Quantity of
items
included in
product
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw Driver
PH00 / PH0 /
PH1
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1.
Remove base screws
2.
Release Batt. cable & K/B membrane & TP FFC, remove C top Assy.
3.
Release Spk. cable & screws, remove Spk.
4.
Release Batt. screws, remove Batt.
5.
Release adaptor cable & FFC & screws, remove USB type C bracket & D/B
6.
Release LCD cable & Cam. cable & antenna & screws, remove USB type C bracket & M/B & WLAN module & FFC &
adaptor cable
7.
Remove LCD bezel
8.
Release screws, remove panel bracket & panel
9.
Remove LCD cover Assy from hinge bracket, chassis
10.
Remove Cam. module & LCD cable & Cam. cable & antenna from LCD cover Assy.
11.
Release screws, remove hinge from base Assy.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained
in the product that require selective treatment (with descriptions and arrows identifying locations).
