
ModeI 400F/FL
the circuit board and components. observe the fol
lowing rules when soldering:
a. Use a low-heat (25 to 50 watts) soldering iron
with a small tip (1/16" to 3/32" diameter).
b. To remove a component. clip a heat sink (long
nose pliers. commercial heat sink tweezers
etc. ) on the component lead as close to the
component as possible. Place the soldering
iron directly on the component lead. and pull
up on the lead.
If
a component is obviously
damaged or faulty. cUp the leads close to the
component and then remove the leads from the
board.
01795-1
Fl'lE?3
EXCESSIVE OR PROLONGED HEAT
CAN UFT THE CIRCUIT FOIL
Section V
Paragraph 5-51 (Coni'd)
FROM THE BOARD OR CAUSE
DAMAGE TO COMPONENTS.
c. Clean the component lead holes by heating the
solder in the hole. quickly removing the
soldering iron. and inserting a pointed. non
metallic object such as a toothpick.
d. To mount a new component. shape the leads
and insert them in the holes. Clip a heat sink
on the component, heat with the soldering
iron. and add solder as necessary to obtain a
good electrical connection.
e. Clip excess leads oH after soldering and clean
excess flux from the connection and adjoining
area. using type TF Freon (-hp- Part No.
8500-0232).
5-7
Содержание 400F
Страница 2: ...Verso Filler Page ...
Страница 3: ...400F FL AC VOLTMETER OPERATING AND SERVICE MANUAL HEWLETT PACKARD ...
Страница 6: ...Verso Filler Page ...
Страница 16: ...Section IV Figure 4 1 4 0 O 1 NO 0 0 ModeI400F FL u 0 8 0 j JO W t 01795 1 ...
Страница 28: ...Verso Filler Page ...
Страница 33: ...Verso Filler Page ...
Страница 53: ......
Страница 54: ...HEWLETTitPACKARD 00467 90003 Printed in U SA ...