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EL-MF877-00                                                                                                Page  2 
Template Revision C  

Last revalidation date 04-01-2018 

                 

 

 

 

 

  

HPI instructions for this template are available at 

EL-MF877-01

  

Item Description 

Notes 

Quantity of 
items 
included in 
product

 

already listed as a separate item above)  
Components and parts containing toner and ink, 
including liquids, semi-liquids (gel/paste) and toner 

Include the cartridges, print heads, tubes, vent 
chambers, and service stations.             

None 

Components and waste containing asbestos 

            

None 

Components, parts and materials containing refractory 
ceramic fibers 

            

None 

Components, parts and materials containing 
radioactive substances 

            

None 

2.0 Tools Required

 

List the type and size of the tools that would typically be used to disassemble the product to a point where components and 
materials requiring selective treatment can be removed. 

Tool Description 

Tool Size (if 
applicable) 

Plastic shovel 

           

Screwdriver 

           

           

           

           

           

           

           

3.0 Product Disassembly Process

 

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment 
including the required steps to remove the external enclosure:  

1.

 

 Remove screws from Rear cover and Separate the Rear Cover Ass'y 

2.

 

 Remove the connector(J2)and(BJ2) of the FCC cable. 

3.

 

 Remove the connector(J3) of the Dispaly key bd cable. 

4.

 

 Remove four screws

 from Main shielding and Panel.And separate the tapes from the Main shielding. 

5.

 

 Remove three screws

from MAIN SHIELDING ang Main BD. 

6.

 

 Remove four screws

 from Main shielding and Main BD.Separate the MAIN SHIELDING from Main BD. 

7.

 

Separate the MAIN BD. 

3.2 Optional Graphic.  If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the 
product that require selective treatment (with descriptions and arrows identifying locations).

 

Содержание 22f

Страница 1: ...icable Item Description Notes Quantity of items included in product Printed Circuit Boards PCB or Printed Circuit Assemblies PCA With a surface greater than 10 sq cm 2 Batteries excluding Li Ion batteries All types including standard alkaline coin or button style batteries None Li Ion batteries Include all Li Ion batteries if more than one is provided with the product such as a detachable notebook...

Страница 2: ...e treatment can be removed Tool Description Tool Size if applicable Plastic shovel Screwdriver 3 0 Product Disassembly Process 3 1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment including the required steps to remove the external enclosure 1 Remove screws from Rear cover and Separate the Rear Cover Ass y 2 Remove the connecto...

Страница 3: ...th a surface greater than 10 square cm 2 Batteries All types including standard alkaline and lithium coin or button style batteries 0 Mercury containing components For example mercury in lamps display backlights scanner lamps switches batteries 0 Liquid Crystal Displays LCD with a surface greater than 100 square cm Includes background illuminated displays with gas discharge lamps 1 Cathode Ray Tub...

Страница 4: ...remove components and materials requiring selective treatment 1 release base stand by pushing a white button then strip screw to separate base and hinge 2 Strip the screws from rear cover so that the rear cover can be removed then remove deco 3 Remove all material under rear cover contain rear cover supporter 4 Separate main board and shielding 5 Release all materials and put some by ESD 3 2OPTION...

Страница 5: ...stricted Page 3 Step 1 Quick release Base stand 1 Pull out base and stand a Press white button with one hand b Pull out stand base with another hand 2 Disassy base and stand Press the white button Twist out the screw ...

Страница 6: ...p the screws from rear cover then move rear cover follow the below way at last remove deco Remove the screws with Screwdriver Dismantle the rear cover first from the two marked position Remove the 8pin FFC from main board then remove rear cover ...

Страница 7: ...5 Step 3 To remove the shielding contain the other material 3 1 Dismantle the rear cover supporter 3 2 Pull out the LVDS LED FFCs to separate the base assembly from the unit 3 3 Remove the four screws to separate shielding from CB ...

Страница 8: ...24 07 201 HP Restricted Page 6 Step 4 Strip the screws 6pcs ...

Страница 9: ...24 07 201 HP Restricted Page 7 Step 5 Release all materials and put some by ESD Can follow the picture as bellow ...

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