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4
4
Operation
Set the temperature control and the air vol-
ume control at the desired settings.
The appropriate temperature for melting sol-
der depends to solder types, e.g. it is relative-
ly higher for read-free solder. Also depends to
the nozzle to be used. Therefore, decide the
setting temperature referring to “Temperature
characteristics” on page 9.
1
2
Hold the blower so that the tip of the nozzle is
directly above the lead wires of the compo-
nent. Take care not to let the nozzle touch the
component at this time.
After the component has been removed, there
will still be some solder remaining on the pat-
tern. Use HOZAN-WICK (desolder braid) such
as H-37-1.3 to clean it.
3
Place the tips of the tweezers against the
corner of the component and push very slight-
ly while heating. When the solder is sufficient-
ly melted, the component will move, and so it
should then be quickly removed.
The pattern peels off if the solder in not suffi-
ciently melted. In such case, reheat the solder
rather than pulling the component off by force.
Air volume characteristics
The blown air volume will vary greatly with the
number of pipes of the nozzle. Turn down the
air volume control if use a nozzle with very
few pipes.
The right graph shows the
relationship
be-
tween
the
position of air
volume
control
and
the
blown
air
volume
when
the
overall cross
section
of the
pipes are 4
π
mm
2
.
Air volume characteristics
Position of air volume control
Air volume (L/min.)
<Measurement method>
Connected to the following flow rate meter and
measured with a 4 mm diameter nozzle.
Flow rate meter : Model N.T.K SCI-S
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