Bill of material
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10 Bill of material
10.1 Overview
The following tables contain the parts which are used on the Evaluation
Boards. These tables contain the description, type and a manufacturer of
the part.
10.2 NRPEB H90-RE
The following table contains the bill of material for the evaluation board
NRPEB H90-RE:
Reference
Description
#
Type (manufacturer)
Manufacturer
B700
Voltage supervision 3V
1
MIC803-30D2VM3
Microchip
C405
Ceramic capacitor SMD1808
1
843-1808YA250102JSU
1808YA250102JXTSPU
1nF 250V -55°C…+155°C
Syfer
C300 C301 C603
C716
Ceramic capacitor SMD0402
4
35.00.48 GRM1555C1H102JA01D
1nF 50V -55°C…+155°C
Murata
C803
Ceramic capacitor SMD0603
1
36.51.43 GRM188R71C105KA12D
1µF 16V -55°C…+155°C
Murata
C307 C713
Ceramic capacitor SMD1210
2
KKK12486 1210AC103KAT1A
10nF 1000V -55°C…+155°C (X7R)
AVX
C501 C502 C503
C504
Ceramic capacitor SMD0402
4
36.62.10 CL05B103KB5NNNC
10nF 50V -55°C…+155°C
Samsung
C710 C711 C807
Ceramic capacitor SMD0402
3
10pF 50V -55°C…+155°C (C0G)
TDK
C200 C203 C703
C708 C714
Ceramic capacitor SMD0805
5
38.18.47 CL21B106KPQNNNG
10µF 10V -55°C…+155°C (X7R)
Samsung
C201 C204 C302
C303 C304 C305
C306 C400 C401
C402 C403 C404
C500 C600 C601
C602 C604 C605
C700 C701 C702
C704 C705 C706
C707 C709 C712
C715 C717 C801
Ceramic capacitor SMD0402
30
33.88.34
GRM155R71C104KA88D1nF 250V
-55°C…+155°C
Murata
C202 C205
Ceramic capacitor SMD0402
2
1nF 250V -55°C…+155°C
Yageo
C718 C719
Ceramic capacitor SMD0603
2
30.71.56 15pF 50V SMD0603
1nF 250V -55°C…+155°C
Murata
C804
Ceramic capacitor SMD0402
1
1nF 250V -55°C…+155°C
Samsung
C800 C802
Ceramic capacitor SMD1210
2
35.83.69 GRM32ER72A225KA35L
1nF 250V -55°C…+155°C
Murata
C805 C806
Ceramic capacitor SMD0805
2
36.24.29 GRM21BR71C475KA73L
1nF 250V -55°C…+155°C
Murata
C720
EEPROM ser. 2kBit 2,5-5,5V
1
AT93C56A
Atmel
G700
Quarz 12MHz SMD
1
JXS32-12M
Jauch
K700
Dual High Speed USB to
Multipurpose UART/FIFO IC
1
FT2232HQ
Future
Technology
Devices Int.
K300
RS232 Transceiver
1
MAX3232EEUP
Maxim
netRAPID 90 | Design guide
DOC190601DG01EN | Revision 1 (Draft 10) | English | 2019-09 | Preliminary | Public
© Hilscher 2019