HF-BL200A Low Energy Bluetooh
(
BLE 4.1
)
Module User Manual
Shanghai High Flying Electronics Technology Co., Ltd www.hi-flying.com
- 47
-
7. PACKAGE INFORMATION
7.1.
Reflow Soldering Profile
Figure 11.
Reflow Soldering Profile
Table 24 Reflow Soldering Specification
Remark:
1. Recommend to supply N2 for reflow oven
2. O2 content lower than 300ppm
;
7.2.
Handling Instruction
1.
Shelf life in sealed bag: 12 months at <30
℃
, <60% humidity
。
2.
After bag opened, device need to be re-baked if window time over 168 hours
3.
Recommended to over bake with N2 supplied
4.
Recommended to reflow oven with N2 supplied
5.
Bake required with 24 hours at 125+-5
℃
,
6.
Recommended to store at
≦
10% RH with vacuum packing
7.
If SMT process needs twice reflow
(1) TOP side
side
Case 1: BLE module mounted on PCB TOP, need to bake TOP side after BOT side processed
168 hours (window time)
Case 2: BLE module mounted on PCB BOT side ,follow normal bake rule.
Remark:
window time means it is been 168 hours since last bake to next flow.
Number
Item
Temp (
℃
)
Time(s)
1
Reflow time
220
℃
above
35~55 s
2
Peak temp
Max 260
℃