12
ODROID C1 USER MANUAL
to dissipate heat (approximately 1cm x 1cm). The heatsink is much
larger and is therefore able to dissipate more heat into the surrounding
air than the processor itself.
Heatsink Installation
Check that you have both parts of the heatsink. You should
have a silver heatsink and a rectangular grey, gummy piece (the ther-
mal pad). These two items are shown in the image along with the C1
unit.
• Remove the transparent plastic backing on the grey thermal pad.
There may be transparent plastic on both sides. Then place the ther-
mal pad over the processor and memory modules as shown in the
following image.
• Remove the plastic film from the white pad on the underside of the
heatsink. The white pad should be stuck to heatsink.
• Align the white pushpins to the correct holes and push both pins
through the holes until a click is heard from each. Check that the
pushpins have been inserted correctly pressing down on them from
the top. They should move a small distance downward freely and then
come back up when you let go.
Heatsink components
Chapter 1
Содержание ODROID-C1
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