This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other
prior permission of GlobalTop Tech Inc
Copyright © 201
GPS Module Application Notes
GlobalTop Technology
Other Cautionary Notes on Reflow
1.
Module must be pre-baked
2.
The usage of solder paste should follow “
needs to be monitored and recorded in a timely
documentation and examples
3.
Temperature and humidity must be controlled
Temperature of 23°C, 60±5% RH humidity is recommended. (please refer to IPQC
for related documentation and examples)
4.
When performing solder paste
excess or insufficient, as both conditions may lead to defects such as electrical shortage,
empty solder and etc.
5.
Make sure the vacuum mouthpiece is able to bear the weight of the GPS module to pr
positional shift during the loading process.
6.
Before the PCBA is going through the reflow
by his/her own eyes to see if there are positional offset to the module.
7.
The reflow temperature and its profile dat
match the levels and guidelines set by IPQC.
8.
If SMT protection line is running a double
module during the second pass only to avoid repeated reflow exposures of the GP
Please contact GlobalTop beforehand if you must process GPS module during the 1
double-side process.
Place GPS module right
his document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
2014 GlobalTop Technology Inc. All Rights Reserved.
Module Application Notes (MT3337 series)
Other Cautionary Notes on Reflow-Soldering Process:
ked
before
going through SMT solder reflow process.
The usage of solder paste should follow “First-in-First-out” principle. Opened solder paste
and recorded in a timely manner (refer to IPQC standards
mples)
dity must be controlled within SMT production line and storage area.
Temperature of 23°C, 60±5% RH humidity is recommended. (please refer to IPQC
for related documentation and examples)
When performing solder paste printing, please notice if the amount of solder paste is in
excess or insufficient, as both conditions may lead to defects such as electrical shortage,
Make sure the vacuum mouthpiece is able to bear the weight of the GPS module to pr
positional shift during the loading process.
Before the PCBA is going through the reflow-soldering process, the operators should check
to see if there are positional offset to the module.
The reflow temperature and its profile data must be measured before the SMT process and
match the levels and guidelines set by IPQC.
If SMT protection line is running a double-sided process for PCBA, please process GPS
module during the second pass only to avoid repeated reflow exposures of the GP
Please contact GlobalTop beforehand if you must process GPS module during the 1
Place GPS module right-side up when running reflow-solder process, do not invert.
35
his document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
Specifications subject to change without prior notice.
GlobalTop Technology Inc. All Rights Reserved.
Ver. A00
going through SMT solder reflow process.
out” principle. Opened solder paste
standards for related
SMT production line and storage area.
Temperature of 23°C, 60±5% RH humidity is recommended. (please refer to IPQC standards
printing, please notice if the amount of solder paste is in
excess or insufficient, as both conditions may lead to defects such as electrical shortage,
Make sure the vacuum mouthpiece is able to bear the weight of the GPS module to prevent
soldering process, the operators should check
a must be measured before the SMT process and
sided process for PCBA, please process GPS
module during the second pass only to avoid repeated reflow exposures of the GPS module.
Please contact GlobalTop beforehand if you must process GPS module during the 1
st
pass of
solder process, do not invert.
