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prior permission of GlobalTop Tech Inc
Copyright © 201
GPS Module Application Notes
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3. Thermal Profile for SMD Modules
The following information
The details are for reference
SMT Reflow Soldering Temperature Profile
Average ramp-up rate (25 ~ 150
Average ramp-up rate (270°C to peak): 3°C/sec. max.
Preheat: 175 ± 25°C, 60 ~ 120 seconds
Temperature maintained above 217°C: 60~150 seconds
Peak temperature: 250 +0/-
Ramp-down rate: 6°C/sec. max.
Time 25°C to peak temperature: 8 minutes max.
SMT Solder Mask
Please use the dimension of PCB pad as reference and shrink the size by 0.1 to 0.2 mm
as layout for paste mask. (For PCB pad layout, please see “Recommended PCB pad layout” on
individual GPS module data sheet)
Manual Soldering
Soldering iron: Bit Temperature:
his document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
2014 GlobalTop Technology Inc. All Rights Reserved.
Module Application Notes (MT3337 series)
. Thermal Profile for SMD Modules
information is Pb-Free compliant.
or reference only.
SMT Reflow Soldering Temperature Profile
up rate (25 ~ 150°C): 3°C/sec. max.
up rate (270°C to peak): 3°C/sec. max.
60 ~ 120 seconds
Temperature maintained above 217°C: 60~150 seconds
-5°C, 20~40 seconds
down rate: 6°C/sec. max.
Time 25°C to peak temperature: 8 minutes max.
Please use the dimension of PCB pad as reference and shrink the size by 0.1 to 0.2 mm
(For PCB pad layout, please see “Recommended PCB pad layout” on
sheet)
Bit Temperature: under 380°C | Time: under 3 second.
21
his document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
Specifications subject to change without prior notice.
GlobalTop Technology Inc. All Rights Reserved.
Ver. A00
compliant.
Please use the dimension of PCB pad as reference and shrink the size by 0.1 to 0.2 mm and use that
(For PCB pad layout, please see “Recommended PCB pad layout” on
