GSWP050W-EVBPA
GaN E-HEMT Wireless Power Transfer Evaluation Board
User’s Guide
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GSWP050W-EVBPA Rev 190304
© 2019 GaN Systems Inc.
www.gansystems.com 10
Please refer to the Evaluation Board/Kit Important Notice on page 22
Figure 10 •
MCU interface definition. Signals on J1
The PA connectivity is depicted in Figure 11 and includes the RF input and output, the DC biases
and the MCU monitor interface.
Figure 11 •
Circuit Connectivity
Protection Circuit
The PA includes circuitry to protect against input DC overcurrent, device over temperature, output
RF overvoltage and Voltage Standing Wave Ratio (VSWR) protection. The protection signals are
combined by U133, a 3 inputs OR gate logic chip, and will shut the driver down under a fault
condition.
Input DC overcurrent protection (OCP): U91 is the DC current sensor chip, which can handle a
maximum of 10A. The output of the current sensor ship is a current sense signal that goes thru
buffer OP U122 and is compared to a reference voltage. The reference voltage is set with R101 and
R177. Upon an over current event, a signal is generated to signal OCP_TRIG.
•
Monitor signals on J1.
•
Pin1: PA GND
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Pin2: 5V Input
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Pin3: output voltage detection
•
Pin4: PA HV DC current
•
Pin5: 3.3V DC
•
Pin6: over voltage and current
•
Pin7: PA ground
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Pin8: Temperature sensor voltage
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Pin9: PA HV DC input
•
Pin10: Fan control enable