MT5Q1070c
2. ヒートシンクへの実装
© Fuji Electric Co., Ltd. All rights reserved.
2-2. Application of thermal grease
It is recommended to apply thermal grease between the
module’s base plate and the heat sink to
ensure heat dissipation to the heat sink.
If the properties, amount, and application method of the thermal grease are not appropriate, it may
result in poor heat dissipation and lead to thermal failure. Table 1 shows the recommended thermal
grease properties and thickness. Assuming that the thickness is uniform, the required amount (weight)
of thermal grease can be calculated from the following formula.
We recommend using the stencil mask method to control the appropriate thermal grease thickness
(Figure. 2). The recommended stencil mask pattern can be provided upon request.
It is recommended to confirm that the thermal grease is spread over the entire
module’s base plate by
removing the module after mounting and check the extent of spreading.
4
Unit
Recommended value
Penetration (typ.)
-
>= 340
Thermal conductivity
W/m
・
K
>= 1
Thermal grease thickness
μm
100 +/- 30
Figure 2. Thermal grease application
Table 1. Recommended properties of thermal grease
Thermal grease
thickness (
μm)
Thermal grease
weight (g) x 10
4
Base plate area of
module (cm
2
)
=
Density of thermal
grease (g/cm
3
)
x
x
Squeegee
(for applying thermal
grease)
Thermal grease
(
apply to module’s
base plate)
Stencil mask
Stencil mask
fixing tool
