MT5Q1070c
© Fuji Electric Co., Ltd. All rights reserved.
(1) Transportation
Transport the carton box with the appropriate side facing up. Otherwise, the product may be
subject to unexpected stress, which may result in bending of terminals, distortion in the resin
package etc. Furthermore, throwing or dropping the product can cause significant damage to the
product. If the product gets wet, it may lead to destruction or malfunction. Please take sufficient
measures against rain and freezing.
(2) Storage
Please manage the storage location so that the temperature is 5 to 35
o
C and the humidity is 45 to
75%. Condensation may form on the surface of semiconductor devices when there are sudden
temperature changes. Avoid such environment and store in a place where temperature changes
are minimal. If more than a year has passed since the product was manufactured under these
storage conditions, confirm that the terminal solderability is not deteriorated before mounting.
Avoid storing in a place where corrosive gas is generated or where there is a lot of dust.
When storing, make sure that no external force or load is applied to the semiconductor device.
Store the terminals of semiconductor devices in an unprocessed state. If the terminals are stored
after the terminal is processed, soldering defects may occur when mounting the product due to rust.
(3) Assembly environment
The semiconductor device in the power module is very vulnerable to electrostatic discharge (ESD).
If excessive static electricity is applied to the control terminal, the device might be destroyed. Take
appropriate measures for ESD in the assembly environment within the scope described in the
IGBT Module Application Manual (Chapter 3-2).
(4) Operating environment
If the product is used in an environment exposed to acids, organic substances, and corrosive
gases (hydrogen sulfide gas, sulfuric acid gas, etc.), the
product’s performance and appearance
may deteriorate.
Cautions
10
