Freescale USB Development Board USB-KW40Z User’s Guide, Rev. 0, 10/2015
22
Freescale Semiconductor, Inc.
PCB manufacturing specifications
•
PCB data:
— USB-KW40Z size: Approximately 18.5x 61.4 mm (0.73 x 2.42 inches)
— USB-KW40Z final thickness (Cu/Cu): 1.57 mm (0.62 inches) +/- 10% (excluding solder mask)
Table 3
defines some of the layers of the completed PCB. The artwork identification refers to the name of
the layer in commonly used terms.
IMPORTANT
: The USB-KW40Z development board contains high frequency 2.4 GHz RF circuitry. As
a result, RF component placement, line geometries and layout, and spacing to the ground plane are critical
parameters. Therefore, BOARD STACKUP GEOMETRY IS CRITICAL. Dielectric and copper
thicknesses and spacing must not be changed; follow the stackup information provided with the reference
design (see
Figure 19
) information provided with the reference design.
Figure 19. USB-KW40Z PCB stackup cross-section (four layer)
•
Solder mask is required
•
Silk screen is required
5.2
Panelization
The panel size can be negotiated depending on production volume.
5.3
Materials
The PCB composite materials must meet the following requirements:
•
Laminate—the base material (laminate) must be FR4. If the laminate material is changed, the RF
electrical characteristics may change and degrade RF performance.
Table 3. USB-KW40Z layer by layer overview
Layer
Artwork Identification
File Name
1
Silkscreen Top
PSS.art
2
Top Layer Metal
L1_PS.art
3
Ground Layer
L2_GND.art
4
Signal Layer
L3_INT_1.art
5
Bottom Layer Metal
L4_SS.art
6
Silkscreen Bottom
SSS.art
