PCB Manufacturing Specifications
Tower KW2xDxxx Hardware Reference Manual, Rev. 0.2
Freescale Semiconductor
4-3
•
Laminate - The base laminate material (laminate) must be FR4. If the laminate material were
changed the RF electrical characteristics may change and degrade RF performance.
•
Copper Foil -
— Top and Bottom copper layers must be 1 oz. copper
— Interior layers must be 1oz. copper
•
Plating - All pad plating must be Hot Air Levelling (HAL)
4.4
Solder Mask
The solder mask must meet the following requirements:
•
Solder mask type: Liquid Film Electra EMP110 or equivalent
•
Solder mask thickness: 10 – 30 µm
4.5
Silk Screen
The silk screen must meet the following requirements:
•
Silkscreen color: White
•
Silkscreen must be applied after application of solder mask if solder mask is required
•
The silkscreen ink must not extend into any plated-thru-holes
•
The silk screen must be clipped back to the line of resistance
4.6
Electrical PCB Testing
•
All PCBs must be 100 percent tested for opens and shorts
•
Impedance Measurement - An impedance measurement report is not mandatory
4.7
Packaging
Packaging for the PCBs must be the following requirements:
•
Finished PCBs must remain in panel
•
Finished PCBs must be packed in plastic bags that do not contain silicones or sulphur materials.
These materials can degrade solderability.
4.8
Hole Specification/Tool Table
See the
ncdrill-1-4.tap
file included with the Gerber files and the
FAB-27694.pdf
file.
