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AN-9111
APPLICATION NOTE
© 2015 Fairchild Semiconductor Corporation
www.fairchildsemi.com
Rev. 1.1
• 6/26/15
4
3. Package
Since heat dissipation is an important factor that limits the power module’s current capability, the heat dissipation
characteristics are critical in determining the SPM package performance. A trade-off exists among heat dissipation
characteristics, package size, and isolation characteristics. The key to a good package technology lies in the accomplishment
of optimization package size while maintaining outstanding heat dissipation characteristics without compromising the
isolation rating.
In the SPM package, technology was developed in which bare ceramic with good heat dissipation characteristics is attached
directly to the lead frame. This technology already applied in SPM, but was improved through new adhesion methods. This
made it possible to achieve improved reliability and heat dissipation, while maintaining cost effectiveness.
FRD
Mosfet
IC
Al Wiring
Cu Wiring
Lead Frame
Ceramic (Isolation material)
EMC(Epoxy Molding Compound)
Epoxy Resin
Figure 4.
Vertical Structure of SPM Package