Espressif Systems ESP32-PICO-V3-ZERO, Руководство пользователя

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6
. Product Handling
6
. Product Handling
6.1
Storage Condition
The products sealed in Moisture Barrier Bag (MBB) should be stored in a noncondensing atmospheric environment
of < 40 °C/90%RH.
The module is rated at moisture sensitivity level (MSL) 3.
After unpacking, the module must be soldered within 168 hours with factory conditions 25±5 °C/60%RH. The
module needs to be baked if the above conditions are not met.
6.2
ESD
• Human body model (HBM): 2000 V
• Charged-device model (CDM): 500 V
• Air discharge: 6000 V
• Contact discharge: 4000 V
6.3
Reflow Profile
50
150
0
25
1 ~ 3 ℃ /s
0
200
250
200
-1 ~ -5 ℃ /s
Cooling zone
100
217
50
100 250
Reflow zone
! 217 ℃ 60 ~ 90s
Temperatur
e (
℃
)
Preheating zone
150 ~ 200 ℃ 60 ~ 120s
Ramp-up zone
Peak Temp.
235 ~ 250 ℃
Soldering time
> 30s
Time (sec.)
Ramp-up zone — Temp. : <150 ℃ Time: 60 ~ 90s Ramp-up rate: 1 ~ 3 ℃ /s
Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120s Ramp-up rate: 0.3 ~ 0.8 ℃ /s
Reflow zone — Temp.: >217 ℃ 7LPH 60 ~ 90s; Peak Temp.: 235 ~ 250 ℃ (<245 ℃ recommended) Time: 30 ~ 70s
Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: -1 ~ -5 ℃ /s
Solder — Sn&Ag&Cu Lead-free solder (SAC305)
Figure
6
: Reflow Profile
Note:
Solder the module in a single reflow. If the PCBA requires multiple reflows, place the module on the PCB during the final
reflow.
Espressif Systems