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S1C88650 TECHNICAL MANUAL
EPSON
161
10 PAD LAYOUT
10 PAD LAYOUT
10.1 Diagram of Pad Layout
6.7 mm
Y
X
(0, 0)
6.7 mm
120
125
130
135
140
145
150
155
160
165
170
175
Die. No.
180
185
190
195
200
205
210
215
220
225
230
235
1
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
115
110
105
100
95
90
80
85
Chip thickness: 400 µm
Pad opening:
90 µm
■
Pad 119 is used for the IC shipment test, so you should not bond it.