23 PACKAGE
S1C17M20/M21/M22/M23/M24/M25
Seiko Epson Corporation
23-1
TECHNICAL MANUAL (Rev. 1.0)
23 Package
SQFN4-24 package (S1C17M20/M23)
(Unit: mm)
3.9
min
/4.1
max
0.35
min
/0.45
max
6
13
1
18
7
24
12
19
INDEX
EXPOSED DIE PAD
2.4
min
/2.6
max
3.9
min
/4.1
max
0
min
1
max
Top View
Bottom View
0.2
min
/0.3
max
0.5
C0.3
2.4
min
/2.6
max
Figure 23.1 SQFN4-24 Package Dimensions
*
The potential of the EXPOSED DIE PAD is the same as that of the substrate potential (V
SS
) on the back of the IC.