EPOX KP6-LS, Руководство пользователя

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Introduction KP6-LS
Page 1-2
Overview
Pentium II
The Pentium
®
II Processor is the follow-on to the Pentium
®
Processor. The
Pentium
®
II Processor, like the Pentium
®
Pro processor, implements a Dynamic
Execution micro-architecture -- a unique combination of multiple branch prediction,
data flow analysis, and speculative execution. This enables the Pentium
®
II Proces-
sor to deliver higher performance than the Pentium
®
processor, while maintaining
binary compatibility with all previous Intel architecture processors.
A significant feature of the Pentium
®
II Processor, from a system perspective, is the
built-in direct multiprocessing support. In order to achieve multiprocessing, and
maintain the memory and I/O bandwidth to support it, new system designs are
needed. For systems with dual processors, it is important to consider the additional
power burdens and signal integrity issues of supporting multiple loads on a high speed
bus. The Pentium
®
II Processor card supports both uni-processor and dual processor
implementations.
The Pentium
®
II Processor utilizes Single Edge Contact (S.E.C.) (Figure 1) cartridge
packaging technology. The S.E.C. cartridge allows the L2 cache to remain tightly
coupled to the processor, while maintaining flexibility when implementing high perfor-
mance processors into OEM systems. The second level cache is performance
optimized and tested at the cartridge level. The S.E.C. cartridge utilizes surface
mounted core components and a printed circuit board with an edge finger
connection. The S.E.C. cartridge package introduced on the Pentium
®
II Processor
will also be used in future Slot 1 processors.
The S.E.C. cartridge has the following features: a thermal plate, a cover and a PCB
with an edge finger connection. The thermal plate allows standardized heatsink
attachment or customized thermal solutions. The thermal plate enables a reusable
heatsink to minimize fit issues for serviceability, upgradeability and replacement. The
full enclosure also protects the surface mount components. The edge finger connec-
tion maintains socketabilty for system configuration. The edge finger connector is
denoted as ‘Slot 1 connector’ in this and other documentation.
The entire enclosed product is called the Pentium
®
II Processor. The packaging
technology and each of the physical elements of the product are referred to using
accurate technical descriptions. This allows clear reference to the products as just a
processor. This is the model used in past packaging technologies like PGA, TCP,
PQFP, DIP, etc.