USER MANUAL V1.2
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TCM 310 / TCM 310C / TCM 310U User Manual | v1.2 | July 2014 | Page 21/28
TCM 310 / TCM 310C / TCM 310U
4.6
Soldering information
TCM 310x shall be soldered according to IPC/JEDEC J-STD-020C standard.
TCM 310 shall be handled according to Moisture Sensitivity Level MSL4 which means a floor
time of 72 h. TCM 310 may be soldered only once, since one time is already consumed at
production of the module itself.
Once the dry pack bag is opened, the desired quantity of units should be removed and the
bag resealed within two hours. If the bag is left open longer than 30 minutes the desiccant
should be replaced with dry desiccant. If devices have exceeded the specified floor life time
of 72 h, they may be baked according IPC/JEDEC J-STD-033B at max. 90°C for less than
60 h.
Devices packaged in moisture-proof packaging should be stored in ambient conditions not
exceeding temperatures of 40 °C or humidity levels of 90% r.H.
TCM 310x modules shall be soldered within 6 months after delivery!
