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emSTAMP Helium (Rev3)

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emSTAMP Helium

Hardware Manual

including the Helium SBC development board and the CPU module

Rev3 / 25.06.2020

Содержание emSTAMP Helium

Страница 1: ...emSTAMP Helium Rev3 1 23 emSTAMP Helium Hardware Manual including the Helium SBC development board and the CPU module Rev3 25 06 2020 ...

Страница 2: ...ion is subject to change without prior notice We assume no liability for erroneous information or its consequences Trademarks used from other companies refer exclusively to the products of those companies Revision 3 25 06 2020 Rev Date Signature Changes 1 25 04 2018 Sk First revision 2 26 03 2020 Bue Update concerning HW Revision 2 3 25 06 2020 Sk Adding FUSE Configuration Clarify Pin Numbering on...

Страница 3: ...8bit mode 11 5 5 2 EDT display connector pinout 12 5 6 Ethernet 12 5 7 Analog to Digital Converter 13 5 8 Status LEDs 13 5 9 Recovery Pin 13 5 10 Base Power Enable Signal 13 5 11 WAKEUP Signal 13 5 12 Reset 13 5 13 Power Supply 14 5 13 1 Overview 14 5 13 2 3V3 Supply 14 5 13 3 Backup Supply 14 5 13 4 VDD_ANA 14 5 13 5 VDD_SDMMC 14 5 14 Castellation Connector 15 6 Functional Description of Helium S...

Страница 4: ...1 Base LEDs 20 6 12 Power Supply 20 6 12 1 5 V Supply 21 6 12 2 3 3 V Supply 21 7 Technical Characteristics 22 7 1 Electrical Specifications 22 7 2 Environmental Specifications 22 7 3 Mechanical Specifications 22 7 3 1 Drawing of SBC developer board 23 ...

Страница 5: ...rial or multimedia applications The processor board is designed as a compact module with castellated edge contacts that can be soldered directly on a baseboard The emSTAMP Helium development board is an SBC build around the CPU module It provides direct access to a set of the module s interfaces It is targeted to quickly start into product development The functionalities of the Helium development ...

Страница 6: ...emSTAMP Helium Rev3 6 23 2 Overview of the Helium development SBC board ...

Страница 7: ...dule does not provide any on board ESD protection circuitry this must be provided by the product it is used in Before installing the module it is recommended that you discharge yourself by touching a grounded object Be sure all tools required for installation are electrostatic discharged as well Before installing or removing the module unplug the power cable from your mains supply Handle the board...

Страница 8: ...e CPU core this processor provides a lot of features such as NAND Flash controller DDR3 SDRAM controller Ethernet MAC 10 100Mbit compatible with the IEEE802 3 standard USB 2 0 Host with high speed mode USB 2 0 OTG with high speed mode SDMM Card host controller LCD Controller for TFT displays up to 1024x768 XGA 60Hz and 16 18 bpp 18 bit RGB interface for EDT TFT displays with integrated capacitive ...

Страница 9: ...emSTAMP Helium Rev3 9 23 Flexcom interfaces providing the following serial interfaces o I C o SPI o U S ART Sound Interface with I S format JTAG debug interface PWM Real time clock ...

Страница 10: ...AM size 5 3 NOR Flash A 4 MB NOR Flash memory is integrated on the CPU module It is used to hold the initial Bootloader that provides the basic boot functionality of the module The memory is connected to the SPI0 CS0 interface of the processor 5 4 NAND Flash An eMMC NAND Flash is provided on the emSTAMP Helium module to store the operating system and application data The storage is connected to th...

Страница 11: ...18 LCDPWM The following table describes the function of the data and control lines Signal Description LCD_D xx 18 color data can also be used in 16 bit mode LCD_VSYNC Vertical synchronization signal LCD_HSYNC horizontal synchronization signal LCD_DEN Data enable signal if active color data are valid LCD_CLK Display clock LCD_DISP Backlight power enable signal LCD_PWM PWM signal to control the back...

Страница 12: ... GND 32 9 GND 33 8 LCD_VCC 34 7 LCD_VCC 35 6 IRQ_TOUCH2 36 5 LCD_BL_CTRL 37 4 SCL_LCD 38 3 n c 39 2 SDA_LCD 40 1 n c 5 6 Ethernet The emSTAMP Helium module provides an Ethernet interface with up to 100BASE TX full duplex The PHY is integrated on the CPU module so that an Ethernet Jack with integrated magnetics may be directly connected to the modules Ethernet pins The Ethernet signal lines are con...

Страница 13: ...l The BASE_PWR_EN signal is used to disable the peripherals on the baseboard while the CPU is in low power sleep mode This signal is low during sleep states and goes high when the CPU starts up or returns to normal state 5 11 WAKEUP Signal The WAKEUP Signal may be used to wake the CPU from power save states The WAKEUP Pin has an internal pull up resistor and should be driven by open drain collecto...

Страница 14: ...ired to use the basic functionality of the module 5 13 3 Backup Supply To use the standby sleep capabilities of the module a 3V supply to the V_BACKUP pin is required A 3V lithium coin cell may be used to provide this supply V_BACKUP is internal ORed with the 3V3 supply by diodes 5 13 4 VDD_ANA VDD_ANA is the reference voltage of the ADC It is internally connected to 3V3 VDD_ANA can be connected t...

Страница 15: ...OM2_IO4 TIOB3 TWCK0 13 PC0 FLEXCOM0_IO4 TWCK0 14 PD28 AD9 SPI1_NPCS0 FLEXCOM2_IO2 15 PD27 AD8 SPI1_MISO FLEXCOM2_IO1 16 PC4 TIOB1 SPI1_NPCS0 I2SC0_DI0 17 PC5 TCLK1 SPI1_NPCS1 I2SC0_DO0 18 PC2 CANRX0 SPI1_MOSI I2SC0_MCK 19 PC1 CANTX0 SPI1_SPCK I2SC0_CK 20 PC3 TIOA1 SPI1_MISO I2SC0_WS 21 PA31 PWML0 CLASSD_L3 22 GND 23 PA30 PWMH0 SDMMC1_CD CLASSD_L2 24 PA22 SDMMC1_SCK 25 PA19 TIOA0 SDMMC1_DAT1 26 PA1...

Страница 16: ...DTRG IRQ TCLK3 51 PB31 FLEXCOM0_IO3 TWD0 52 PB30 FLEXCOM0_IO2 TCLK5 53 PB29 FLEXCOM0_IO1 TIOB5 54 PB28 FLEXCOM0_IO0 TIOA5 55 GND 56 BASE_PWR_EN 57 PB1 PWML1 CLASSD_R0 58 PD21 AD2 TIOB2 TWD0 FLEXCOM4_IO0 I2SC0_WS 59 PD20 AD1 TIOA2 UTXD2 I2SC0_MCK 60 PD22 AD3 TCLK2 TWCK0 FLEXCOM4_IO1 I2SC0_DI0 61 PD19 AD0 PCK0 URXD2 I2SC0_CK 62 DEBUG_TXD 63 DEBUG_RXD 64 ETH_TD 65 ETH_TD 66 ETH_RD 67 ETH_RD 68 GND ...

Страница 17: ...further provisions A write protect signal line is not provided Pin Signal 1 D2 PA20 2 D3 PA21 3 CMD PA28 4 VDD VDD_SDMMC 5 CLK PA22 6 GND 7 D0 PA18 8 D1 PA19 9 CD PA30 10 GND 6 2 Ethernet A 10 100 MBit Ethernet interface is available via RJ45 connector The center taps of the magnetics are connected to a 3 3V DC supply There no traffic or Link LEDs available Pin Signal 1 n c 2 n c 3 TD ETH_TDP 4 TX...

Страница 18: ...The interface is realized by the internal device controller of the processor The interface is USB 2 0 compliant supporting data transfers at low speed 1 5Mbps full speed 12 Mbps and high speed 480Mbps If the ID signal PC5 is tied to GND logical 0 by an external device connector the CPU module enters host mode A floating ID signal places the CPU in device mode In host mode bus supply can be control...

Страница 19: ...0 Part A B and ISO 11898 1 supporting both standard and extended message frames The LVTTL transmit and receive signals of the CAN channel are directly connected from the Helium module to the pin header Additionally 3 3 V supply and GND are provided The signal level is 3 3V The maximum baud rate is 1Mbps For a connection to a CAN network a transceiver must be connected to the pin header Emtrion s A...

Страница 20: ...BC developer board to use the RESET function 6 10 Backup Battery By the V_BAK Signal the processor on the Helium module can be supplied by an external battery An external battery holder is added on the SBC developer board 6 11 Base LEDs With two PWM signals PA31 and PB1 two status indication LEDs can be driven from the processor on the Helium module The LEDs are added on the SBC developer board 6 ...

Страница 21: ...Supply The 3 3 Volt on the baseboard are generated directly from the main power supply via a buck regulator There are two 3 3 V power rails The first is a always on rail and is used only for the CPU module The second is switched and generated to supply the interfaces and all other components The switched 3 3 V is active as soon as the BASE_PWR_EN signal from the CPU module is asserted ...

Страница 22: ...ronmental Specifications Operating temperature CPU module 0 C 70 C SBC board 0 C 70 C Storage temperature Storage temp CPU module 10 85 C Storage temp SBC board 10 85 C Relative humidity Relative humidity 0 95 non condensing 7 3 Mechanical Specifications Mechanical Specifications Weight CPU module approx t b d g Weight SBC board approx t b d g Dimensions CPU module 53 4 mm x 38 1 mm x 1 6 mm Dimen...

Страница 23: ...emSTAMP Helium Rev3 23 23 7 3 1 Drawing of SBC developer board 38 10 mm 53 34 mm 110 0 mm 72 0 mm ...

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