Chengdu Ebyte Electronic Technology Co.,Ltd.
ESP32-WROVER-IE User Manual
Copyright ©2012–2019，Chengdu Ebyte Electronic Technology Co.,Ltd.
12
Ⅵ Welding Operation Guidance
6.1 Reflow temperature
Profile Feature
Curve characteristics
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Tin paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）
Minimum preheating temperature
100℃
150℃
Preheat temperature max (Tsmax)
Maximum preheating temperature
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheat time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average ascent rate
3℃/second max
3℃/second max
Liquidous Temperature (TL)
Liquidus temperature
183℃
217℃
Time（tL）Maintained Above（TL）
Time above liquidus
60-90 sec
30-90 sec
Peak temperature（Tp）
Peak temperature
220-235℃
230-250℃
Aveage ramp-down rate（Tp to Tsmax）
Average rate of descent
6℃/second max
6℃/second max
Time 25℃ to peak temperature
Time from 25℃ to peak temperature
6 minutes
max
8
minutes max
6.2 Reflow soldering curve
Содержание ESP32-WROVER-IE
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