Ebyte E75-2G4M20S, Руководство пользователя

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Chengdu Ebyte Electronic Technology Co.,Ltd. E75-2G4M20S User Manual
Copyright ©2012–2018
，
Chengdu Ebyte Electronic Technology Co.,Ltd.
7
lead to a permanent damage to the module.

Please check the stability of power supply and ensure the voltage not to fluctuate too much.

Please make sure anti-static measures are taken when installing and using, high frequency devices have electrostatic
susceptibility.

Please ensure the humidity is within limited range for some parts are sensitive to humidity.

Please avoid using modules under too high or too low temperature.
5.3 Bit error rate is too high

When there are co-channel signal interference nearby, be away from interference sources or modify frequency and
channel to avoid interference;

The clock waveform on the SPI is not standard. Check whether there is interference on the SPI line. The SPI bus
should not be too long.

Unfavorable power supply may cause messy code. Make sure that the power supply is reliable.

Extension line and feeder with poor quality or too long ones will cause high bit error rate.
6. Production Guidance
6.1 Reflow Soldering Temperature
Profile Feature Sn-Pb Assembly Pb-Free Assembly
Solder Paste Sn63/Pb37 Sn96.5/Ag3/Cu0.5
Preheat Temperature min
（
Tsmin
）
100℃ 150℃
Preheat temperature max (Tsmax) 150℃ 200℃
Preheat Time (Tsmin to Tsmax)(ts) 60-120 sec 60-120 sec
Average ramp-up rate(Tsmax to Tp) 3℃/second max 3℃/second max
Liquidous Temperature (TL) 183℃ 217℃
Time
（
tL
）
Maintained Above
（
TL
）
60-90 sec 30-90 sec
Peak temperature
（
Tp
）
220-235℃ 230-250℃
Aveage ramp-down rate
（
Tp to Tsmax
）
6℃/second max 6℃/second max
Time 25℃ to peak temperature 6 minutes max 8 minutes max