Chengdu Ebyte Electronic Technology Co.,Ltd. E28-2G4M27S User Manua
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Chengdu Ebyte Electronic Technology Co.,Ltd.
8
7. Production Guidance
7.1 Reflow Soldering Temperature
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min
（
Tsmin
）
100℃
150℃
Preheat temperature max (Tsmax)
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
3℃/second max
3℃/second max
Liquidous Temperature (TL)
183℃
217℃
Time
（
tL
）
Maintained Above
（
TL
）
60-90 sec
30-90 sec
Peak temperature
（
Tp
）
220-235℃
230-250℃
Aveage ramp-down rate
（
Tp to Tsmax
）
6℃/second max
6℃/second max
Time 25℃ to peak temperature
6 minutes max
8 minutes max
7.2 Reflow Soldering Curve
