Ebyte E19-868M20S, Руководство пользователя

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Chengdu Ebyte Electronic Technology Co., Ltd. E19 -868M20S User Manual
Copyright ©2012–2018
，
Chengdu Ebyte Electronic Technology Co.,Ltd. 8
Profile Feature Curve characteristics Sn-Pb Assembly Pb-Free Assembly
Solder Paste Solder paste Sn63/Pb37 Sn96.5/Ag3/Cu0.5
Preheat Temperature min
（
Tsmin
）
Min preheating temp.
100℃ 150℃
Preheat temperature max (Tsmax) Mx preheating temp.
150℃ 200℃
Preheat Time (Tsmin to Tsmax)(ts) Preheating time 60-120 sec 60-120 sec
Average ramp-up rate(Tsmax to Tp) Average ramp-up rate
3℃/second max 3℃/second max
Liquidous Temperature (TL) Liquid phase temp.
183℃ 217℃
Time
（
tL
）
Maintained Above
（
TL
）
Time below liquid phase line 60-90 sec 30-90 sec
Peak temperature
（
Tp
）
Peak temp. 220-235℃ 230-250℃
Aveage ramp-down rate
（
Tp to Tsmax
）
Aveage ramp-down rate
6℃/second max 6℃/second max
Time 25℃ to peak temperature
Time to peak temperature
for 25℃
max 6 minutes max 8 minutes
7.2 Reflow soldering curve