Ebyte E104-BT55SP, Руководство пользователя

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Chengdu Ebyte Electronic
Technology Co., Ltd
E83-2G4M03S User Manual
Copyright ©2012–2019, Chengdu Ebyte Electronic
Technology Co., Ltd
9
25°C.
When soldered components need to be re-profiled, they should be reflowed with a carrier fixture of the same
construction, or verified to have an equivalent thermal load.
The reflow profiles in this document are some suggestions for soldering only Ebyte modules, and cannot be
used to confirm the actual assembly profile of the user. The actual production process of the user should be based
on the specific production process, needs and circuit board design to develop the actual production assembly curve,
and should not exceed the parameters in the table below.
Reflow Profile Characteristics Leaded process assembly Lead-free process assembly
Preheat/Keep Warm
lowest temperature
（Tsmin）
100℃ 150℃
maximum temperature
（TSMDx）
150℃ 200℃
time（Tsmin~Tsmin） 60-120 seconds 60-120 seconds
Heating slope（TL~Tp） 3°C/sec, max 3°C/sec, max
liquidus temperature（TL） 183℃ 217℃
Hold time above TL 60~90 seconds 60~90 seconds
Package body peak temperature Tp
The user cannot exceed the
temperature indicated on the
product's "Moisture Sensitivity"
label
The user cannot exceed the
temperature indicated on the
product's "Moisture Sensitivity"
label
Time (Tp) within 5°C of the specified
grading temperature (Tc), see the figure
below
20 seconds 30 seconds
cooling slope（Tp~TL） 6°C/sec, max 6°C/sec, max
Time from room temperature to peak
temperature
6 minutes, maximum 8 minutes, maximum
※The peak temperature (Tp) tolerance definition of the temperature profile is the upper limit of the user