Ebyte E104-BT10, Руководство пользователя

Страница: 7 / 30

Chengdu Ebyte Electronic Technology Co., Ltd E104-BT10 User Manual
Copyright ©2012–2019
，
C
hengdu Ebyte Electronic Technology Co., Ltd
3-6
19 VCC -
Power supply, 1.9V ~ 3.6V (recommend to add external ceramic filter
capacitor)
20 GND - Ground, connecting to power source reference ground
21 PC5 - GPIO
22 PC4 - GPIO
23 PD2 - GPIO
24 PD3 - GPIO
25 RST input Chip reset initiation input pin, valid under low level
26 GND - Ground, connecting to power source reference ground
3
、
Basic Operation
3.1 Hardware design

It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible, and
the module needs to be reliably grounded;

Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse
connection may cause permanent damage to the module;

Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the
maximum value the module will be permanently damaged;

Please check the stability of the power supply, the voltage can not be fluctuated frequently;

When designing current supply circuit, 30% margin is recommended to be remained so as to ensure long-term
stable operation of the whole module;

The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other
parts with large electromagnetic interference;

High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the
module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the
copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital part of
the module and routed in the Bottom Layer;

Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer
or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees;

It is assumed that there are devices with large electromagnetic interference around the module that will greatly
affect the performance. It is recommended to keep them away from the module according to the strength of the
interference. If necessary, appropriate isolation and shielding can be done;

Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog,
power traces) around the module that will greatly affect the performance of the module. It is recommended to stay
away from the module according to the strength of the interference.If necessary, appropriate isolation and shielding
can be done;

Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0;

The module must not be installed inside metal shield, which will greatly reduce the transmission distance.