Ebyte E10-433MS, Руководство пользователя

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Chengdu Ebyte Electronic Technology Co., Ltd. E10-433MS User Manual
Copyright ©2012–2021
，
Chengdu Ebyte Electronic Technology Co.,Ltd.
9
susceptibility.

Please ensure the humidity is within limited range, some parts are sensitive to humidity.

Please avoid using modules under too high or too low temperature.
6.3 BER(Bit Error Rate) is high

There are co-channel signal interference nearby, please be away from interference sources or modify frequency and
channel to avoid interference;

Poor power supply may cause messy code. Make sure that the power supply is reliable.

The extension line and feeder quality are poor or too long, so the bit error rate is high;
7 Production guidance
7.1 Reflow soldering temperature
Profile Feature Curve characteristics Sn-Pb Assembly Pb-Free Assembly
Solder Paste Solder paste Sn63/Pb37 Sn96.5/Ag3/Cu0.5
Preheat Temperature min
（
Tsmin
）
Min preheating temp. 100℃ 150℃
Preheat temperature max (Tsmax) Mx preheating temp. 150℃ 200℃
Preheat Time (Tsmin to Tsmax)(ts) Preheating time 60-120 sec 60-120 sec
Average ramp-up rate(Tsmax to Tp) Average ramp-up rate 3℃/second max 3℃/second max
Liquidous Temperature (TL) Liquid phase temp. 183℃ 217℃
Time
（
tL
）
Maintained Above
（
TL
）
Time below liquid phase line 60-90 sec 30-90 sec
Peak temperature
（
Tp
）
Peak temp. 220-235℃ 230-250℃
Aveage ramp-down rate
（
Tp to Tsmax
） Aveage ramp-down rate 6℃/second max 6℃/second max
Time 25℃ to peak temperature
Time to peak temperature for
25℃
max 6 minutes max 8 minutes