3.
Removing the LCD and Printed Circuit / Wiring Boards
Beside the LCD and the main PCB, there are further
small PCBs and components
which are
in the scope of the WEEE Directive. The removal of these components is described in detail in
the
chapter 4
of the associated maintenance manual.
Replacement Procedures
Figures
Figure 4.2 Removing Base Enclosure ...................................................................................... 4-7
Figure 4.3 Removing Battery Pack ........................................................................................ 4-9
Figure 4.4 Removing SSD ................................................................................................... 4-13
Figure 4.5 Removing SODIMM ........................................................................................... 4-14
Figure 4.6 Removing LCD Module Assembly ..................................................................... 4-17
Figure 4.7 Removing the CPU Cooling Module and Fan ..................................................... 4-19
Figure 4.7 Applying silicon grease (CPU)............................................................................. 4-20
Figure 4.8 Removing System Board ...................................................................................... 4-21
Figure 4.9 Removing IO Board ............................................................................................ 4-23
Figure 4.10 Removing Speaker .............................................................................................. 4-25
Figure 4.11 Removing the LCD Module Mask .................................................................... 4-27
Figure 4.12 Removing LCD Panel follow direction. ........................................................... 4-29
Figure 4.12 Removing the LCD cable .................................................................................. 4-32
Figure 4.12 LCD cable below the LCD module cover latch ................................................. 4-32
Figure 4.13 Removing the CCD Module .............................................................................. 4-33
Figure 4.14 Removing the Touch pad Module......................................................................4-35
