Dragon Group China Bird AC-5K, Руководство пользователя

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中龙集团
Dragon Group China Limited
BIRD
®
www.dragongroupchina.com
www.chinaemall.biz
2.Desoldering
Put PCB on the positioning bracket, choose the appropriate hot-air reflow nozzle, set
the right soldering temperature curve, and press the START button. After the procedure is
over, move the hot-air nozzle away by hand, and use the vacuum suction pen to remove
BGA.
3.Clean the soldering pad.
There are mainly 2 ways: one is use suction line to make it flat, the other is use the
soldering iron to remove the dregs directly. It is better to remove the dregs soon after the
desoldering of BGA, for the BGA has not cooled down, and the damage caused by
temperature difference is less.To use some flux paste when cleaning the pad can increase
the solder activity and achieve better cleaning effect. Be careful to not to destroy PCB pad!
Try to use some volatile solvents.
4.Reballing
Lay the BGA Flux Paste on the BGA pad evenly with a brush. Choose
corresponding steel net, and plant the soldering ball on the BGA pad with a BGA Reball
Kit.
5.Soldering
Put the BGA on the bottom heating area of BGA Rework Station, and solder the
balls on the pad.
6.Lay on Flux paste
Lay the BGA Flux Paste on the BGA pad evenly with a brush, no more, no less.
7.Mounting
Mount the BGA on the right place of PCB. When we place in by hand, we can make
use of the silk screen borders. We can touch the surface of the pad and the balls to know
whether it is placed in the right area.
8.Soldering
Put PCB with new-mounted BGA on the positioning bracket, move the hot-air nozzle
to the right place, choose the appropriate hot-air reflow nozzle, set the right soldering
temperature curve, and press the START button. After the procedure is over, turn on the
cooling fan to cool down BGA for 30-40 seconds, and elevate the upper hot-air nozzle to
be 8-10mm away from the surface of BGA. Or move away the hot-air nozzle after the
START light is off, then remove PCB from the heating area.