6
(三)
Specification
:
Description
:
1.
Embedded industrial PC, high definition touch screen, human-machine interface operation,
PLC control, and instant curve analysis function. Real-time display settings and actual
temperature curve, which can also be used to analyze and correct the curve if necessary.
2.
It uses high precise k-type thermocouple closed-loop control and automatic temperature
compensation system, with PLC and temperature module to enable precise temperature
deviation to add and subtract 2 degrees. Meanwhile, external temperature measurement
connector enables temperature diction and accurate analysis of real time temperature curve.
3.
V-groove PCB works for rapid, convenient and accurate positioning, which can meet all kinds
of PCB board of positioning.
4.
Flexible and convenient removable fixture on the PCB board can protect the PCB fringe
devices from damaging and transmuting. It can also adapt to various BGA „s reworking.
5.
Various sizes of BGA alloy nozzles, which can be adjusted 360 degree for easily installation
and replacement.
6.
Three temperature areas can independently heat and they are multiple temperature control,
which can ensure best integration of different temperature areas. Heating temperature, time,
slope, cooling and vacuum can all be set in the human-machine interface.
7.
There are 6-8 temperature controls up and down. Massive storage of temperature curves
which are accessible at any time according to different BGA. Curve analysis, setting and
adjustment are also accessible via touch screen. Three heating areas adopt independent PID
calculation to control heating process to enable more accurate temperature.
8.
It uses high power cross-flow fan to enable fast cooling of PCB board and prevent PCB from
deformation. There are also internal vacuum pump and external vacuum chuck, which can
help to fetch the BGA chip
;
Total Power
4900W
Top heater
800W
Bottom heater
Second heater 1200W
,
IR preheating 2700w,digital thermostat soldering
iron 80W
power
AC220V±10
%
50/60Hz
Dimensions
L650×W700×H650 mm
Positioning
V-groove, PCB support can be adjusted in any direction with external
universal fixture
Temperature control
K Sensor, Closed loop
Temp accuracy
±2
℃
PCB size
Max 500×450 mm Min 22×22 mm
BGA chip
2X2-80X80mm
Minimum chip spacing
0.15mm
External Temperature
Sensor
1
(
optional
)
Net weight
48kg
Содержание DH-A1L-C
Страница 1: ...1 DH A1L C BGA rework station manual ...