Module specifications
Environmental specifications
ConnectCore® 8X System-on-Module Hardware Reference Manual
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Environmental specifications
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Operating temperature: -40 to 85 C.
CAUTION!
Your final product may require additional thermal management such as
passive (heatsink/spreader) or active (airflow) cooling to achieve the maximum
operating temperature without exceeding the processor junction temp limit.
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The ConnectCore 8X module shall be built in an enclosure so the shield is not accessible to the
end user.
Mechanical specifications
See the
for links to mechanical drawings and other design documents.
MTBF
MTBF (Mean Time Before Failure) has been estimate using the method of prediction Telcordia
Reliability Prediction Procedure, SR-332, Issue 4, “Parts Count” Method.
The following assumptions have been made:
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An average ambient temperature of +23°C.
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Electrical Stress of 50%
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Quality Level II for all components
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Mission profile considered in this analysis is a yearly continuous operation i.e. always operating
On, 365 days per year.
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Average module temperature rise = 17°C
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Two different environmental factors have been considered:
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An environmental factor of π~E~ = 1.2 is defined in SR-332 for Ground, Fixed, Uncontrolled
(limited) environments (GL).
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An environmental factor of π~E~ = 2 is defined in SR-332 for Ground, Mobile environments
(GM).
Product variant
Ground fixed, Uncontrolled (limited) –
MTTF (hours)
Ground Mobile – MTTF
(hours)
ConnectCore 8X
wireless
1 926 782
1 156 069
ConnectCore 8x non-
wireless
2 409 639
1 445 087
Failure rate and MTTF (Mean Time To Failure) for different operational temperature:
