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Osbourne User Manual V0.21 

www.diamondsystems.com

   

     

Page 4 

1  IMPORTANT SAFE HANDLING INFORMATION 

 

WARNING!

 

 

ESD-Sensitive Electronic Equipment 

Observe ESD-safe handling procedures when working with this product. 

Always use this product in a properly grounded work area and wear 
appropriate ESD-preventive clothing and/or accessories. 

Always store this product in ESD-protective packaging when not in use. 

 

Safe Handling Precautions 

Diamond  Systems  boards  are  designed  with  complex  circuitry  and  electronic  components  that  are  ESD-
sensitive. This increases the likelihood of the boards incurring accidental damage during handling, installation, 
and connection to other equipment.  
It  is  highly  recommended  that  the  following  precautionary  measures  and  best  practices  be  observed  in 
sequential order: 

 

Wear an anti-static Wristband/Strap or/and an antistatic Lab Coat or/and Rubber-soled shoes. 

 

Spread anti-static mats over the table or work surface or/and anti-static mats on the floor. 

 

Unpack components and remove them from their anti-static bags only when they are ready to be 
used. 

 

Avoid ungrounded surfaces such as plastic, carpets, floors, or tables, in the work area. 

 

Handle boards by the edges and their metal mounting brackets. Avoid touching components on the 
boards and the edge connectors that connect to expansion slots. 

The following information describes common causes of failure found on boards and components returned to 
Diamond Systems for repair. It is provided as a guideline to avoid accidental damage.

 

ESD Damage

: This type of damage is typically impossible to detect because there is no visual sign of failure 

or  damage.  In  this  type  of  damage,  the  board  eventually  stops  functioning  because  of  some  defective 
components. Usually, the failure can be identified, and the chip can be replaced.  
To prevent ESD damage, always follow proper ESD-prevention practices when handling computer boards. 

 

Damage During Handling or Storage

: Physical damage on boards also occur due to mishandling. A common 

observation  is  that  of  a  screwdriver  slipping  on  the  board  during  installation,  causing  a  gouge  on  the  PCB 
surface, cutting signal traces or damaging components.  
Another common observation is damaged board corners, indicating the board was dropped. This may or may 
not cause damage to the circuitry, depending on components located near the edges. Most Diamond System 
boards are designed with a minimum 25 mils clearance between the board edge and component pad. The 
ground/power planes are located a minimum of 20 mils from the edge to avoid possible shorting from this type 
of damage. However, these design rules do not prevent damage in all situations.  
Sometimes boards are stored in racks with slots that grip the edge of the board. This is a common practice for 
board manufacturers. Though  Diamond Systems  boards  are resilient to damages, the components  located 
close to the board edges can be damaged or even knocked off the board if the board lies tilted in the rack.  
Diamond Systems recommends that all its boards be stored only in individual ESD-safe packaging units. If 
multiple boards are stored together, they should be contained in bins with dividers placed between the boards. 
Do  not  pile  boards  on  top  of  each  other  or  cram  too  many  boards  within  a  small  location.  This  can  cause 
damage to connector pins or fragile components. 

Содержание OSBOURNE

Страница 1: ...GX ORIN Module User Manual Revision No Release Date Comments 0 21 12 05 2022 Initial Release Copyright 2022 Diamond Systems Corporation www diamondsystems com FOR TECHNICAL SUPPORT PLEASE CONTACT Emai...

Страница 2: ...Digital I O 12 3 11 CAN 12 3 12 Utility 12 3 13 LED Indicators 12 4 Functional Block Diagram 13 4 1 Baseboard Block Diagram 13 4 2 AGX Orin Series Module Block Diagram 14 5 Mechanical Drawing 15 6 Co...

Страница 3: ...com Page 3 9 1 B2B I O Board Connectivity 34 9 1 1 Block Diagram for I O Connector 34 9 1 2 Mechanical Drawings For I O Connector 35 9 2 B2B 1G Ethernet Board Connector 36 9 2 1 Mechanical Drawing 36...

Страница 4: ...to detect because there is no visual sign of failure or damage In this type of damage the board eventually stops functioning because of some defective components Usually the failure can be identified...

Страница 5: ...ed to the power supply In this case the board will likely be irreparable and must be replaced A chip destroyed by reverse or excessive power will often have a visible hole or show some deformation on...

Страница 6: ...or Header J4 RTC 3V power input for RTC functionality Signal Terminated to 150 Position RA Connector Header J4 Ethernet 1G 2 5G 5G 10G Multi Mode Gigabit Ethernet without on board Magnetics Signal Ter...

Страница 7: ...20mm x 115mm Cooling Mechanism Conduction Cooling Power Input Range 7 to 20VDC 18V Typical Operating Temperature Range 25 C to 80 C at Thermal Transfer Plate TTP surface of Orin Module 2 2 Osbourne Or...

Страница 8: ...Osbourne User Manual V0 21 www diamondsystems com Page 8 2 3 Product Photos Orin module installation side I O expansion side...

Страница 9: ...core Arm Cortex A78AE v8 2 64 bit CPU 3MB L2 6MB L3 CPU Max Frequency 2 2 GHz 2 2 GHz Memory 32GB 256 bit LPDDR5 204 8GB s 64GB 256 bit LPDDR5 204 8GB s Video Encode 1x 4K60 H 265 3x 4K30 H 265 6x 10...

Страница 10: ...to support the highest capacity on board memory and have enough reserve capacity to support the below add on features Power Requirements for Supplementary Features VIN 12 V 5V 3 3V Feature 5 4A 6A Jet...

Страница 11: ...erial Ports The board supports up to 4 serial ports from the module Two numbers of RS232 422 485 ports are derived using single SP336 transceiver Software control for protocols selection via GPIOs pro...

Страница 12: ...Configuration Jumper Selection Section 3 10 Digital I O The board provides 8x digital I O s which are individually configurable as an output or input Digital I Os are realized using an I2C GPIO expand...

Страница 13: ...MGBE Port 0 FAN Control Minicard Socket 2 Secure SPI NOR Thermal Sensor I2S1 I2C1 CAN 0 CAN 1 GPIO Exp 8x DIO CAN TXR Audio Codec USB2 Hub Common Configuration 1 Only Configuration 2 Only FAN Connect...

Страница 14: ...Page 14 4 2 AGX Orin Series Module Block Diagram The following Block Diagram illustrates a high level view of the AGX Orin Series components The ports are broken out through the carrier board Figure 4...

Страница 15: ...Osbourne User Manual V0 21 www diamondsystems com Page 15 5 MECHANICAL DRAWING Below Figures Depict the Top and Bottom Mechanical view of the Baseboard Figure 5 1 Baseboard Mechanical Top View...

Страница 16: ...Osbourne User Manual V0 21 www diamondsystems com Page 16 Figure 5 1 Baseboard Mechanical Bottom View...

Страница 17: ...ode Enabled Disabled TX2 121E Termination Enabled for SER2 TX RS 485 RS 422 Mode Enabled Disabled RX2 121E Termination Enabled for SER2 RX RS 485 RS 422 Mode Enabled Disabled Default Mode 6 1 2 DIO Ju...

Страница 18: ...X0_P USB3 Diff pair PCIe Diff pair Output Bi directional 3 3 5 0 V DIO_PA3 19 20 USB3 PCIE_UPHY _TX0_N USB3 Diff pair PCIe Diff pair Output Bi directional 3 3 5 0 V DIO_PA2 21 22 GND_DIG Ground Bi dir...

Страница 19: ...r CAN0_L 77 78 NC Bi directional CAN Differential Pair CAN0_H 79 80 NC Input RS232 RS422 RS485 CTS2 RX2_N 81 82 NC Input RS232 RS422 RS485 RX2 RX2_P 83 84 NC Bi directional RS232 RS422 RS485 RTS2 TX2_...

Страница 20: ...Bi directional Output 3 3 V SPI1_CS0_3P3 123 124 GND_DIG Ground Input 3 3 V SPI1_MISO_3P3 125 126 MGBE0_PHY_B_P 1G Eth differential Pair Bi directional Output 3 3 V SPI1_MOSI_3P3 127 128 MGBE0_PHY_B_...

Страница 21: ...32 CSI_3_D1_P CSI_2_D1_N 33 34 CSI_3_D1_N GND 35 36 GND CSI_4_D0_P 37 38 CSI_6_D0_P CSI_4_D0_N 39 40 CSI_6_D0_N GND 41 42 GND CSI_4_CLK_P 43 44 CSI_6_CLK_P CSI_4_CLK_N 45 46 CSI_6_CLK_N GND 47 48 GND...

Страница 22: ..._PWM 109 110 VDD_3V3 CAM_SPI_SCK NC 111 112 CAM_SPI_MOSI NC CAM_SPI_CS0 NC 113 114 CAM_SPI_MISO NC GND 115 116 GND CAM_INT1 117 118 VDD_3V3 CAM_VDD_SYS_EN 119 120 VDD_3V3 GND 121 122 GND GND 123 124 G...

Страница 23: ...end of the module installation site are not connected to ground PEX_WAKE_N 1 2 3 3V NC 3 4 GND NC 5 6 1 5V PEX_C5_CLKREQ_N 7 8 NC GND 9 10 NC MPCIE_CLK_N 11 12 NC MPCIE_CLK_P 13 14 NC GND 15 16 NC KEY...

Страница 24: ...dule installation site are not connected to ground PEX_WAKE_N 1 2 3 3V NC 3 4 GND NC 5 6 1 5V PEX_C0_CLKREQ_N 7 8 V_SIM_PWR GND 9 10 SIM_DATA PEX_CLK0_N 11 12 SIM_CLK PEX_CLK0_P 13 14 SIM_RST GND 15 1...

Страница 25: ...PCIE_CLK_N A14 A1 GND UPHY_RX12_PCIE_P A16 B17 PCIE_PRSNT UPHY_RX12_PCIE_N A17 B12 PEX_C5_CLKREQ_N UPHY_TX12_PCIE_P B14 B4 GND UPHY_TX12_PCIE_N B15 A4 GND UPHY_RX13_P A21 B7 GND UPHY_RX13_N A22 A12 GN...

Страница 26: ...A68 A51 GND NC A69 B52 GND NC B66 B53 GND NC B67 A54 GND NC A72 A55 GND NC A73 B56 GND NC B70 B57 GND NC B71 A58 GND NC A76 A59 GND NC A77 B60 GND NC B74 B61 GND NC B75 A62 GND NC A80 A63 GND NC A81...

Страница 27: ...3V UPHY_TX22_P 13 14 3 3V GND 15 16 3 3V UPHY_RX23_N 17 18 3 3V UPHY_RX23_P 19 20 N C GND 21 22 N C UPHY_TX23_N 23 24 N C UPHY_TX23_P 25 26 N C GND 27 28 N C UPHY_RX10_N 29 30 N C UPHY_RX10_P 31 32 N...

Страница 28: ...CMD 11 12 I2S4_DIN SDMMC1_D0 13 14 I2S4_DOUT SDMMC1_D1 15 16 NC SDMMC1_D2 17 18 GND SDMMC1_D3 19 20 M2E_BT_WAKE M2E_SDIO_WAKE 21 22 UART5_RX_1P8_M2E M2E_SDIO_EN 23 32 UART5_TX_1P8_M2E KEY GND 33 34 UA...

Страница 29: ...D 5 6 1 8 V GND 7 8 GND RGMII_RD3_1P8 9 10 RGMII_TD0_1P8 RGMII_RD2_1P8 11 12 RGMII_TD1_1P8 RGMII_RD1_1P8 13 14 RGMII_TD2_1P8 RGMII_RD0_1P8 15 16 RGMII_TD3_1P8 RGMII_RX_CTL_1P8 17 18 RGMII_TX_CTL_1P8 R...

Страница 30: ...part number 538 53398 0471 1 9 Auxiliary Power Out J6 A 2 pin 12V Friction Lock type connector provides 12V power that can be used to power other devices in the system or to provide additional power...

Страница 31: ...ourne User Manual V0 21 www diamondsystems com Page 31 7 3 Jetson Orin B2B Connector Interface The following table figure depicts Jetson AGX Orin Series Module Connector Pin Out Matrix Part 1 Columns...

Страница 32: ...Osbourne User Manual V0 21 www diamondsystems com Page 32...

Страница 33: ...ed spacers NA M 2 SSD M Key Amphenol 10128798 005RLF 75 pin M 2 M keyed socket 2242 with PCB mount threaded spacer NA Module Connector Molex 2034560003 699 pin board to board connector 8mm B2B NA x16...

Страница 34: ...ails of the I O Connector Refer Main I O Connector Section 9 1 1 Block Diagram for I O Connector Commercial IO Block Diagram Rev 0p3 Power In Power Jack 18 Vin HDMI Type A RA Vertical RJ45 MagJack dua...

Страница 35: ...Osbourne User Manual V0 21 www diamondsystems com Page 35 9 1 2 Mechanical Drawings For I O Connector Figure 3 Mechanical outline Top view...

Страница 36: ...ard RJ45 connector mounted on I O board Add on board has single port 1G speed ethernet PHY and other Power Regulator MDI signals are routed through Osbourne Baseboard 150 pin I O connector to commerci...

Страница 37: ...5G 5G 10G Multi Mode Gigabit Ethernet without on board Magnetics 10 100 1000Mbps through RGMII adapter board without on board Magnetics Mass Storage 2x mPCIe socket 1 M 2 M Key 2280 or 2242 NVMe expan...

Страница 38: ...the shipping document The Customer will prepay the shipment cost of the product to the Diamond Systems Corporation designated site Diamond Systems Corporation will prepay the return shipping cost of...

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