Table 21. Troubleshooting 2U alarm conditions (continued)
Status
Severity
Alarm
Enclosure configuration error (VPD)
Fault – critical
S1
Low warning temperature alert
Warning
S1
High warning temperature alert
Warning
S1
Over-temperature alarm
Fault – critical
S4
I
2
C bus failure
Fault – loss of redundancy
S1
Ops panel communication error (I
2
C)
Fault – critical
S1
RAID error
Fault – critical
S1
SBB interface module fault
Fault – critical
S1
SBB interface module removed
Warning
None
Drive power control fault
Warning – no loss of disk power
S1
Drive power control fault
Fault – critical – loss of disk power
S1
Drive removed
Warning
None
Insufficient power available
Warning
None
PCM faults
Table 22. PCM recommended actions
Symptom
Cause
Recommended action
Ops panel Module Fault LED is amber
Any power fault
Verify AC mains connections to PCM are live
Fan Fail LED is illuminated on PCM
Fan failure
Replace PCM
Thermal monitoring and control
The storage enclosure system uses extensive thermal monitoring and takes a number of actions to ensure component
temperatures are kept low, and to also minimize acoustic noise. Air flow is from the front to the back of the enclosure.
Table 23. Thermal monitoring recommended actions
Symptom
Cause
Recommended action
If the ambient air is
below 25ºC (77ºF), and
the fans are observed to
increase in speed, then some
restriction on airflow may
be causing additional internal
temperature rise.
NOTE:
This is not a fault
condition.
The first stage in the thermal
control process is for the fans
to automatically increase in speed
when a thermal threshold is
reached. This may be caused by
higher ambient temperatures in the
local environment, and may be
perfectly normal.
NOTE:
This threshold changes
according to the number of
disks and power supplies
installed.
1. Check the installation for any airflow restrictions at
either the front or back of the enclosure. A minimum
gap of 25 mm (1") at the front and 50 mm (2") at the
rear is recommended.
2. Check for restrictions due to dust build-up. Clean as
appropriate.
3. Check for excessive re-circulation of heated air from
rear to front. Use of the enclosure in a fully enclosed
rack is not recommended.
4. Verify that all blank modules are in place.
5. Reduce the ambient temperature.
38
Troubleshooting and problem solving