Feature
PowerEdge R840
PowerEdge R830
Internal GPU and FPGA
Up to 2x 300W GPUs or up to 2 FH
FPGAs
N/A
Availability
Hot-plug Redundant Cooling
Hot-plug Drives
Hot-plug Redundant Power Supplies
Boot Optimized Storage Subsystem
(BOSS)
IDSDM
Hot-plug Drives Hot-plug Redundant
Cooling Hot-plug Redundant Power
Supplies IDSDM
Technical specifications
Table 3. Technical specifications
Feature
PowerEdge R840 technical specification
Form factor
2U rack
Processor
Intel Xeon Scalable Processor Family
Processor sockets
4 sockets
Internal interconnect
Up to 3 Intel Ultra Path Interconnect (Intel® UPI)
Chipset
Intel C620 series Chipset
Memory
•
Supports DDR4 RDIMM and LRDIMM
•
Up to 1.5TB RDIMMs
•
Up to 6TB LRDIMMs
•
48 DIMM slots: 8GB, 16GB, 32GB, 64GB, 128GB DDR4 up to 2666 MT/s
I/O slots
Up to 6 x PCIe Gen 3 slots
RAID controller
Internal controllers: S140, HBA 330, PERC H330P, PERC H730P, PERC H740P
External controllers: 12 Gbps SAS HBA
Hard drives
•
8 x 2.5 inch SAS/SATA drives
•
24 x 2.5 inch SAS/SATA/NVMe drives
•
24 x 2.5 inch SAS/SATA/NVMe 2 x 2.5 inch rear SAS/SATA
Embedded NIC
•
4 x 1GB
•
4 x 10GB
•
2 x 10GB + 2 x 1GB
•
2 x 25GB
Power supply
Two back accessible hot pluggable PSUs
•
750 W AC PSU
•
750 W Mixed Mode HVDC PSU (for China only)
•
1100 W AC PSU
•
1100 W DC PSU
•
1100 W Mixed Mode HVDC PSU (for Japan and China only)
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