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Direct contact liquid cooling (DCLC)
The PowerEdge C6420 introduces Direct Contact Liquid Cooling (DCLC) support with our partner CoolIT Systems. DCLC offers
customers multiple advantages over air cooling:
•
Improves overall data center Power Utilization Efficiency (PUE)
•
Improves power efficiency of servers and eliminates need for costly cooling infrastructure such as chillers and CRAC units, thus
lowering overall cost and improving TCO
•
Improves life of IT infrastructure
NOTE:
•
DCLC is available in select countries with C6420 launch.
•
DCLC orders must be entered into the LOT tool. DCLC orders will have an extended lead time of about 4-6 weeks.
The following table describes the three key components of the DCLC:
Components
Description
CPU cold plate loop
The CoolIT Systems cold plates, specifically designed for use
with Intel Xeon, are passive CPU Cooling solutions managed by
centralized pumping architectures. These passive cold plate
assemblies replace heatsinks and are purpose-designed to
accommodate C6420 compute sleds. For C6420 DCLC solution,
the cold plates are sold and supported by Dell EMC.
Rack Manifold
Coolant tubes come out of each sled and connect to a manifold
unit. Made with reliable stainless steel and 100% non-drip quick
disconnects, Rack Manifolds can be arranged horizontally or
vertically for a manual connection at the front or back of the
rack. For C6420 DCLC solution, the manifolds are sold (via S&P)
and supported by CoolIT or Authorized Service Provider.
Heat Exchanger
While Server Modules and Manifold Modules are installed with
each system and are local to the rack, the appropriate heat
rejection method may vary. CoolIT Systems Rack DCLC product
line offers a variety of Heat Exchange Modules depending on
load requirements and availability of facility water, including CHx
(Liquid-to-Liquid), AHx (Liquid-to-Air) and custom options. For
C6420 DCLC solution, the heat exchangers are sold (via S&P)
and supported by CoolIT or Authorized Service Provider.
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