Document Number: 002-00833 Rev. *L
Page 45 of 74
S29VS256R
S29VS128R
S29XS256R
S29XS128R
Notes:
1. Maximum I
CC
specifications are tested with V
CC
= V
CC
max.
2. V
CC
= V
IO
3. I
CC
active while Embedded Erase or Embedded Program is in progress.
4. Device enters automatic sleep mode when addresses are stable for t
ACC
+ 20 ns. Typical sleep mode current is equal to I
CC3
.
5. Total current during accelerated programming is the sum of V
PP
and V
CC
currents.
6. I
CC5
applies while reading the status register during program and erase operations.
7. Effect of status register polling during write not included.
10.4
Capacitance
Notes:
1. Test conditions T
A
= 25°C, f = 1.0 MHz
2. Sampled, not 100% tested.
I
CC6
V
CC
Sleep Current
CE# = V
IL
, OE# = V
IH
20
40
µA
I
PP
Accelerated Program Current
CE# = V
IL
, OE# = V
IH,
V
PP
= 9.5 V
V
PP
7
10
mA
V
CC
25
28
mA
V
IL
Input Low Voltage
V
IO
= 1.8 V
–0.2
0.4
V
V
IH
Input High Voltage
V
IO
= 1.8 V
V
IO
– 0.4
V
IO
+ 0.4
V
OL
Output Low Voltage
I
OL
= 100 µA, V
CC
= V
CC
min
= V
IO
0.1
V
V
OH
Output High Voltage
I
OH
= –100 µA, V
CC
= V
CC
min
= V
IO
V
IO
– 0.1
V
V
HH
Voltage for Accelerated
Program
8.5
9.5
V
V
LKO
Low V
CC
Lock-out Voltage
1.0
1.1
V
Table 41. CMOS Compatible (Continued)
Parameter
Description
Test Conditions (Notes
1
&
2
)
Min
Typ
Max
Unit
Symbol
Description
Test Condition
Min.
Typ.
Max.
Unit
C
IN
Input Capacitance
(Address, CE#, OE#,
WE#, AVD#, WE#, CLK,
RESET#)
V
IN
= 0
Single Die
2.0
4.5
6.0
pF
Dual Die
4.0
9.0
12.0
pF
C
OUT
Output Capacitance
(DQ, RDY)
V
OUT
= 0
Single Die
2.0
4.5
6.0
pF
Dual Die
4.0
9.0
12.0
pF