CY62158EV30 MoBL
®
Document #: 38-05578 Rev. *D
Page 11 of 11
Document History Page
Document Title: CY62158EV30 MoBL
®
, 8-Mbit (1024K x 8) Static RAM
Document Number: 38-05578
REV.
ECN NO.
Issue Date
Orig. of
Change
Description of Change
**
270329
See ECN
PCI
New Data Sheet
*A
291271
See ECN
SYT
Converted from Advance Information to Preliminary
Changed I
CCDR
from 4 to 4.5
µ
A
*B
444306
See ECN
NXR
Converted from Preliminary to Final.
Removed 35 ns speed bin
Removed “L” bin.
Removed 44 pin TSOP II package
Included 48 pin TSOP I package
Changed the I
CC
Typ value from 16 mA to 18 mA and I
CC
max value from 28
mA to 25 mA for test condition f = fax = 1/t
RC.
Changed the I
CC
max value from 2.3 mA to 3 mA for test condition f = 1MHz.
Changed the I
SB1
and
I
SB2
max value from 4.5
µ
A to 8
µ
A and Typ value from
0.9
µ
A to 2
µ
A respectively.
Updated Thermal Resistance table
Changed Test Load Capacitance from 50 pF to 30 pF.
Added Typ value for I
CCDR .
Changed the I
CCDR
max value from 4.5
µ
A to 5
µ
A
Corrected t
R
in Data Retention Characteristics from 100
µ
s to t
RC
ns
Changed t
LZOE
from 3 to 5
Changed t
LZCE
from 6 to 10
Changed t
HZCE
from 22 to 18
Changed t
PWE
from 30 to 35
Changed t
SD
from 22 to 25
Changed t
LZWE
from 6 to 10
Updated the ordering Information and replaced the Package Name column with
Package Diagram.
*C
467052
See ECN
NXR
Included 44 pin TSOP II package in Product Offering.
Removed TSOP I package; Added reference to CY62157EV30 TSOP I
Updated the ordering Information table
*D
1015643
See ECN
VKN
Added footnote #8 related to I
SB2
and I
CCDR
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