CY8C20x36/46/66, CY8C20396
Document Number: 001-12696 Rev. *D
Page 9 of 34
24-Pin QFN
Note
3. The center pad (CP) on the QFN package must be connected to ground (Vss) for best mechanical, thermal, and electrical performance. If not connected to ground, it
must be electrically floated and not connected to any other signal.
Table 3. Pin Definitions - CY8C20336, CY8C20346
[2, 3]
Pin
No.
Type
Name
Description
Figure 3. CY8C20336, CY8C20346 PSoC Device
Digital Analog
1
IO
I
P2[5]
Crystal output (XOut)
2
IO
I
P2[3]
Crystal input (XIn)
3
IO
I
P2[1]
4
IOHR
I
P1[7]
I2C SCL, SPI SS
5
IOHR
I
P1[5]
I2C SDA, SPI MISO
6
IOHR
I
P1[3]
SPI CLK
7
IOHR
I
P1[1]
ISSP CLK
[1]
, I2C SCL, SPI
MOSI
8
NC
No connection
9
Power
Vss
Ground connection
10
IOHR
I
P1[0]
ISSP DATA
[1]
, I2C SDA, SPI
CLK
11
IOHR
I
P1[2]
12
IOHR
I
P1[4]
Optional external clock input
(EXTCLK)
13
IOHR
I
P1[6]
14
Input
XRES
Active high external reset with
internal pull down
15
IO
I
P2[0]
16
IOH
I
P0[0]
17
IOH
I
P0[2]
18
IOH
I
P0[4]
19
IOH
I
P0[6]
20
Power
Vdd
Supply voltage
21
IOH
I
P0[7]
22
IOH
I
P0[5]
23
IOH
I
P0[3]
Integrating input
24
IOH
I
P0[1]
Integrating input
CP
Power
Vss
Center pad must be connected
to ground
LEGEND
A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output.
AI
, DA
T
A
2
, I2
C
SD
A
, SPI
C
L
K
, P1[
0
]
QFN
(Top View)
AI, I2C SCL, SPI SS, P1[7]
AI, I2C SDA, SPI MISO, P1[5]
AI, SPI CLK, P1[3]
1
2
3
4
5
6
18
17
16
15
14
13
P0[2], AI
P0[0], AI
24
23
22
21
20
19
P0[3
], A
I
P0[5
], A
I
P0[7
],
AI
Vd
d
P0[4], AI
7
8
9
10
11
12
S
P
I M
O
SI,
P1
[1]
A
I, P
1
[2
]
AI, P2[1]
NC
P1[6], AI
A
I, E
X
T
C
LK
,
P
1
[4
]
XRES
P2[0], AI
P
0
[6],
AI
AI, CL
K
2
, I
2
C
SCL
P
0
[1],
AI
Vss
AI, XOut, P2[5]
AI, XIn, P2[3]
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