CY8C21634, CY8C21534
CY8C21434, CY8C21334, CY8C21234
Document Number: 38-12025 Rev. *O
Page 38 of 45
Figure 28. 56-Pin (300-Mil) SSOP
Thermal Impedances
51-85062 *C
Table 40. Thermal Impedances per Package
Package
Typical
θ
JA
[22]
Typical
θ
JC
16 SOIC
123
o
C/W
55
o
C/W
20 SSOP
117
o
C/W
41
o
C/W
28 SSOP
96
o
C/W
39
o
C/W
32 QFN
[23]
5x5 mm 0.60 MAX
27
o
C/W
15
o
C/W
32 QFN
[23]
5x5 mm 0.93 MAX
22
o
C/W
12
o
C/W
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