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4-Mbit (128K x 32) Pipelined Sync SRAM

CY7C1339G

Cypress Semiconductor Corporation

198 Champion Court

San Jose

,

CA 95134-1709

408-943-2600

Document #: 38-05520 Rev. *F

 Revised July 5, 2006

Features

• Registered inputs and outputs for pipelined operation

• 128K × 32 common I/O architecture 

• 3.3V core power supply (V

DD

)

• 2.5V/3.3V I/O power supply (V

DDQ

)

• Fast clock-to-output times 

— 2.6 ns (for 250-MHz device)

• Provide high-performance 3-1-1-1 access rate

• User-selectable burst counter supporting Intel

®

 

Pentium

®

 interleaved or linear burst sequences

• Separate processor and controller address strobes

• Synchronous self-timed writes

• Asynchronous output enable

• Available in lead-free 100-Pin TQFP package, lead-free 

and non-lead-free 119-Ball BGA package

• “ZZ” Sleep Mode Option

Functional Description

[1]

The CY7C1339G SRAM integrates 128K x 32 SRAM cells with
advanced synchronous peripheral circuitry and a two-bit
counter for internal burst operation. All synchronous inputs are
gated by registers controlled by a positive-edge-triggered
Clock Input (CLK). The synchronous inputs include all
addresses, all data inputs, address-pipelining Chip Enable
(CE

1

), depth-expansion Chip Enables (CE

2

 and

 

CE

3

), Burst

Control inputs (ADSC, ADSP,  and ADV), Write Enables
(BW

[A:D]

, and BWE), and Global Write (GW). Asynchronous

inputs include the Output Enable (OE) and the ZZ pin.

Addresses and chip enables are registered at rising edge of
clock when either Address Strobe Processor (ADSP) or
Address Strobe Controller (ADSC) are active. Subsequent
burst addresses can be internally generated as controlled by
the Advance pin (ADV).

Address, data inputs, and write controls are registered on-chip
to initiate a self-timed Write cycle.This part supports Byte Write
operations (see Pin Descriptions and Truth Table for further
details). Write cycles can be one to four bytes wide as
controlled by the byte write control inputs. GW when active
LOW causes all bytes to be written. 

The CY7C1339G operates from a +3.3V core power supply
while all outputs may operate with either a +2.5 or +3.3V
supply. All inputs and outputs are JEDEC-standard
JESD8-5-compatible.

1

Note: 

1. For best-practices recommendations, please refer to the Cypress application note 

System Design Guidelines 

on www.cypress.com.

A DDRESS
REGISTER

A DV

CLK

BURST

COUNTER

A ND

LOGIC

CLR

Q1

Q0

A DSP

A DSC

M ODE

BW E

GW

CE

1

CE

2

CE

3

OE

ENA BLE

REGISTER

OUTPUT

REGISTERS

SENSE
A M PS

OUTPUT
BUFFERS

E

PIPELINED

ENA BLE

INPUT

REGISTERS

A 0, A 1, A

BW

B

BW

C

BW

D

BW

A

M EM ORY

A RRA Y

D Q s

SLEEP

CONTROL

ZZ

A

[1:0]

2

DQ

A

BY TE

W RITE REGISTER

DQ

B

BY TE

W RITE REGISTER

DQ

C

BY TE

W RITE REGISTER

DQ

D

BY TE

W RITE REGISTER

DQ

A

BY TE

W RITE DRIVER

DQ

B

BY TE

W RITE DRIVER

DQ

C

BY TE

W RITE DRIVER

DQ

D

BY TE

W RITE DRIVER

Logic Block Diagram

[+] Feedback 

Содержание CY7C1339G

Страница 1: ...Write GW Asynchronous inputs include the Output Enable OE and the ZZ pin Addresses and chip enables are registered at rising edge of clock when either Address Strobe Processor ADSP or Address Strobe...

Страница 2: ...A DQA DQA DQA VSSQ VDDQ DQA DQA NC NC DQC DQC VDDQ VSSQ DQC DQC DQC DQC VSSQ VDDQ DQC DQC NC VDD NC VSS DQD DQD VDDQ VSSQ DQD DQD DQD DQD VSSQ VDDQ DQD DQD NC A A CE 1 CE 2 BW D BW C BW B BW A CE 3 V...

Страница 3: ...sampled only when a new external address is loaded CE2 Input Synchronous Chip Enable 2 Input active HIGH Sampled on the rising edge of CLK Used in conjunction with CE1 and CE3 to select deselect the d...

Страница 4: ...tate to a selected state its outputs are always tri stated during the first cycle of the access After the first cycle of the access the outputs are controlled by the OE ADV Input Synchronous Advance I...

Страница 5: ...s conducted the data presented to the DQs is written into the corresponding address location in the memory core If a Byte Write is conducted only the selected bytes are written Bytes not selected duri...

Страница 6: ...X X X L H H H H L L H Q READ Cycle Suspend Burst Current X X X L H H H H H L H Tri State READ Cycle Suspend Burst Current H X X L X H H H L L H Q READ Cycle Suspend Burst Current H X X L X H H H H L H...

Страница 7: ...rite Bytes C B H L H L L H Write Bytes C B A H L H L L L Write Byte D DQD H L L H H H Write Bytes D A H L L H H L Write Bytes D B H L L H L H Write Bytes D B A H L L H L L Write Bytes D C H L L L H H...

Страница 8: ...V for 2 5V I O IOL 1 0 mA 0 4 V VIH Input HIGH Voltage 9 for 3 3V I O 2 0 VDD 0 3V V for 2 5V I O 1 7 VDD 0 3V V VIL Input LOW Voltage 9 for 3 3V I O 0 3 0 8 V for 2 5V I O 0 3 0 7 V IX Input Leakage...

Страница 9: ...Junction to Ambient Test conditions follow standard test methods and procedures for measuring thermal impedance per EIA JESD51 30 32 34 1 C W JC Thermal Resistance Junction to Case 6 85 14 0 C W AC T...

Страница 10: ...1 5 1 5 ns Hold Times tAH Address Hold After CLK Rise 0 3 0 5 0 5 0 5 ns tADH ADSP ADSC Hold After CLK Rise 0 3 0 5 0 5 0 5 ns tADVH ADV Hold After CLK Rise 0 3 0 5 0 5 0 5 ns tWEH GW BWE BWX Hold Af...

Страница 11: ...CE3 is HIGH tCYC t CL CLK ADSP t ADH t ADS ADDRESS t CH OE ADSC CE tAH tAS A1 tCEH tCES GW BWE BW A D Data Out Q High Z tCLZ tDOH tCO ADV tOEHZ tCO Single READ BURST READ tOEV tOELZ tCHZ ADV suspends...

Страница 12: ...ADS ADDRESS tCH OE ADSC CE tAH tAS A1 tCEH tCES BWE BW A D Data Out Q High Z ADV BURST READ BURST WRITE D A2 D A2 1 D A2 1 D A1 D A3 D A3 1 D A3 2 D A2 3 A2 A3 Data In D Extended BURST WRITE D A2 2 Si...

Страница 13: ...ed by ADSP or ADSC 21 GW is HIGH Switching Waveforms continued tCYC tCL CLK ADSP tADH tADS ADDRESS tCH OE ADSC CE tAH tAS A2 tCEH tCES BWE BW A D Data Out Q High Z ADV Single WRITE D A3 A4 A5 A6 D A5...

Страница 14: ...entering ZZ mode See Cycle Descriptions table for all possible signal conditions to deselect the device 23 DQs are in high Z when exiting ZZ sleep mode Switching Waveforms continued t ZZ I SUPPLY CLK...

Страница 15: ...39G 166BGXC 119 ball Ball Grid Array 14 x 22 x 2 4 mm Lead Free CY7C1339G 166AXI 51 85050 100 pin Thin Quad Flat Pack 14 x 20 x 1 4 mm Lead Free Industrial CY7C1339G 166BGI 51 85115 119 ball Ball Grid...

Страница 16: ...IONS IN MILLIMETERS BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 0 30 0 08 0 65 20 00 0 10 22 00 0 20 1 40 0 05 12 1 1 60 MAX 0 05 MIN 0 60 0 15 0 MIN 0 25 0 7 8X STAND OFF...

Страница 17: ...al components in life support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user The inclusion of Cypress products in life support systems ap...

Страница 18: ...ormation by shading and unshading MPNs as per availability C 351194 See ECN PCI Updated Ordering Information Table D 366728 See ECN PCI Added VDD VDDQ test conditions in DC Table Modified test conditi...

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