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CY7C1241V18, CY7C1256V18
CY7C1243V18, CY7C1245V18

Document Number: 001-06365 Rev. *D

Page 9 of 28

Depth Expansion

The CY7C1243V18 has a Port Select input for each port. This
enables easy depth expansion. Both Port Selects are sampled
on the rising edge of the Positive Input Clock only (K). Each port
select input can deselect the specified port. Deselecting a port
does not affect the other port. All pending transactions (read and
write) are completed before the device is deselected. 

Programmable Impedance

An external resistor, RQ, must be connected between the ZQ pin
on the SRAM and V

SS 

to enable the SRAM to adjust its output

driver impedance. The value of RQ must be 5X the value of the
intended line impedance driven by the SRAM. The allowable
range of RQ to guarantee impedance matching with a tolerance
of ±15% is between 175

Ω

 and 350

Ω

with V

DDQ

= 1.5V.  The

output impedance is adjusted every 1024 cycles upon power up
to account for drifts in supply voltage and temperature.

Echo Clocks

Echo clocks are provided on the QDR-II+ to simplify data capture
on high speed systems. Two echo clocks are generated by the
QDR-II+. CQ is referenced with respect to K and CQ is refer-
enced with respect to K. These are free running clocks and are
synchronized to the input

 

clock of the QDR-II+. The timing for the

echo clocks is shown in 

“Switching Characteristics” on page 23

.

Valid Data Indicator (QVLD)

QVLD is provided on the QDR-II+ to simplify data capture on high
speed systems. The QVLD is generated by the QDR-II+ device
along with data output. This signal is also edge-aligned with the
echo clock and follows the timing of any data pin. This signal is
asserted half a cycle before valid data arrives. 

Delay Lock Loop (DLL)

These chips use a DLL that is designed to function between 120
MHz and the specified maximum clock frequency. The DLL may
be disabled by applying ground to the DOFF pin. When the DLL
is turned off, the device behaves in QDR-I mode (with 1.0 cycle
latency and a longer access time). For more information, refer to
the application note, 

DLL Considerations in

QDRII/DDRII/QDRII+/DDRII+

. The DLL can also be reset by

slowing or stopping the input clocks K and K for a minimum of 30
ns. However, it is not necessary for the DLL to be reset to lock to
the desired frequency. During power up, when the DOFF is tied
HIGH, the DLL is locked after 2048 cycles of stable clock.

[+] Feedback 

[+] Feedback 

Содержание CY7C1241V18

Страница 1: ...e QDR II architecture consists of two separate ports to access the memory array The read port has dedicated data outputs to support read operations and the write port has dedicated data inputs to supp...

Страница 2: ...ister Reg Reg Reg 16 20 8 32 8 NWS 1 0 VREF Write Add Decode Write Reg 16 A 19 0 20 1M x 8 Array 1M x 8 Array 1M x 8 Array Write Reg Write Reg Write Reg 8 CQ CQ DOFF QVLD 1M x 9 Array CLK A 19 0 Gen K...

Страница 3: ...Reg 36 19 18 72 18 BWS 1 0 VREF Write Add Decode Write Reg 36 A 18 0 19 512K x 18 Array 512K x 18 Array 512K x 18 Array Write Reg Write Reg Write Reg 18 CQ CQ DOFF QVLD 256K x 36 Array CLK A 17 0 Gen...

Страница 4: ...C VSS NC Q2 NC NC NC VREF NC NC VDDQ NC VDDQ NC NC VDDQ VDDQ VDDQ D1 VDDQ NC Q1 NC VDDQ VDDQ NC VSS NC D0 NC TDI TMS VSS A NC A NC D2 NC ZQ NC Q0 NC NC NC NC A NC 144M CY7C1256V18 4M x 9 2 3 4 5 6 7 1...

Страница 5: ...D5 NC NC VREF NC Q3 VDDQ NC VDDQ NC Q5 VDDQ VDDQ VDDQ D4 VDDQ NC Q4 NC VDDQ VDDQ NC VSS NC D2 NC TDI TMS VSS A NC A D7 D6 NC ZQ D3 Q2 D1 Q1 D0 NC A NC CY7C1245V18 1M x 36 2 3 4 5 6 7 1 A B C D E F G H...

Страница 6: ...ss Inputs Sampled on the rising edge of the K clock during active read and write opera tions These address inputs are multiplexed for both read and write operations Internally the device is organized...

Страница 7: ...is pin to ground turns off the DLL inside the device The timing in the DLL turned off operation is different from that listed in this data sheet For normal operation this pin can be connected to a pul...

Страница 8: ...ing edge of the Positive Input Clock K This enables a seamless transition between devices without the insertion of wait states in a depth expanded memory Write Operations Write operations are initiate...

Страница 9: ...generated by the QDR II CQ is referenced with respect to K and CQ is refer enced with respect to K These are free running clocks and are synchronized to the input clock of the QDR II The timing for t...

Страница 10: ...D A K SRAM 4 RQ 250ohms ZQ CQ CQ Q K RPS WPS BWS D A K SRAM 1 RQ 250ohms ZQ CQ CQ Q K RPS WPS BWS RPS WPS BWS R 50ohms Vt V 2 DDQ R Notes 2 X Don t Care H Logic HIGH L Logic LOW represents rising edg...

Страница 11: ...7C1241V18 only the upper nibble D 7 4 is written into the device D 3 0 remains unaltered CY7C1243V18 only the upper byte D 17 9 is written into the device D 8 0 remains unaltered H L L H During the da...

Страница 12: ...y the byte D 17 9 is written into the device D 8 0 and D 35 18 remain unaltered H L H H L H During the data portion of a write sequence only the byte D 17 9 is written into the device D 8 0 and D 35 1...

Страница 13: ...lling edge of TCK Instruction Register Three bit instructions can be serially loaded into the instruction register This register is loaded when it is placed between the TDI and TDO pins as shown in TA...

Страница 14: ...egister After the data is captured it is possible to shift out the data by putting the TAP into the Shift DR state This places the boundary scan register between the TDI and TDO pins PRELOAD places an...

Страница 15: ...3V18 and CY7C1245V18 follows 11 TEST LOGIC RESET TEST LOGIC IDLE SELECT DR SCAN CAPTURE DR SHIFT DR EXIT1 DR PAUSE DR EXIT2 DR UPDATE DR SELECT IR SCAN CAPTURE IR SHIFT IR EXIT1 IR PAUSE IR EXIT2 IR U...

Страница 16: ...GH Voltage 0 65VDD VDD 0 3 V VIL Input LOW Voltage 0 3 0 35VDD V IX Input and Output Load Current GND VI VDD 5 5 A 0 0 1 2 29 30 31 Boundary Scan Register Identification Register 0 1 2 108 0 1 2 Instr...

Страница 17: ...MSH TMS Hold after TCK Clock Rise 5 ns tTDIH TDI Hold after Clock Rise 5 ns tCH Capture Hold after Clock Rise 5 ns Output Times tTDOV TCK Clock LOW to TDO Valid 10 ns tTDOX TCK Clock LOW to TDO Invali...

Страница 18: ...struction Codes Instruction Code Description EXTEST 000 Captures the input output ring contents IDCODE 001 Loads the ID register with the vendor ID code and places the register between TDI and TDO Thi...

Страница 19: ...35 10E 63 2A 91 3L 8 9R 36 10D 64 1A 92 1M 9 11P 37 9E 65 2B 93 1L 10 10P 38 10C 66 3B 94 3N 11 10N 39 11D 67 1C 95 3M 12 9P 40 9C 68 1B 96 1N 13 10M 41 9D 69 3D 97 2M 14 11N 42 11B 70 3C 98 3P 15 9M...

Страница 20: ...e power and clock K K for 2048 cycles to lock the DLL DLL Constraints DLL uses K clock as its synchronizing input The input must have low phase jitter which is specified as tKC Var The DLL functions a...

Страница 21: ...A Nominal Impedance VDDQ 0 2 VDDQ V VOL LOW Output LOW Voltage IOL 0 1 mA Nominal Impedance VSS 0 2 V VIH Input HIGH Voltage VREF 0 1 VDDQ 0 15 V VIL Input LOW Voltage 0 15 VREF 0 1 V IX Input Leakage...

Страница 22: ...Ambient Test conditions follow standard test methods and procedures for measuring thermal impedance per EIA JESD51 16 25 C W JC Thermal Resistance Junction to Case 2 91 C W AC Test Loads and Waveforms...

Страница 23: ...2 0 2 ns tCQDOH tCQHQX Echo Clock High to Data Invalid 0 2 0 2 0 2 ns tCQH tCQHCQL Output Clock CQ CQ HIGH 25 0 88 1 03 1 15 ns tCQHCQH tCQHCQH CQ Clock Rise to CQ Clock Rise 25 rising edge to rising...

Страница 24: ...A WPS RPS K K DON T CARE UNDEFINED CQ CQ tCQOH CCQO t tCQOH CCQO t tQVLD QVLD tQVLD Read Latency 2 0 Cycles CLZ t t CO tDOH tCQDOH CQD t tCHZ Q00 Q01 Q20 Q02 Q21 Q03 Q22 Q23 tCQH tCQHCQH Q Notes 30 Q...

Страница 25: ...all Fine Pitch Ball Grid Array 15 x 17 x 1 4 mm Industrial CY7C1256V18 375BZI CY7C1243V18 375BZI CY7C1245V18 375BZI CY7C1241V18 375BZXI 51 85195 165 ball Fine Pitch Ball Grid Array 15 x 17 x 1 4 mm Pb...

Страница 26: ...0BZXC CY7C1241V18 300BZI 51 85195 165 ball Fine Pitch Ball Grid Array 15 x 17 x 1 4 mm Industrial CY7C1256V18 300BZI CY7C1243V18 300BZI CY7C1245V18 300BZI CY7C1241V18 300BZXI 51 85195 165 ball Fine Pi...

Страница 27: ...Y7C1245V18 Document Number 001 06365 Rev D Page 27 of 28 Package Diagram Figure 5 165 ball FBGA 15 x 17 x 1 40 mm 51 85195 0 2 2 8 8 8 3 4 0 0 2 2 4 0 6 7 44 6 7 0 2 0 2 3 2 0 490 3 2 3 3 4 3 0 7 4 G...

Страница 28: ...LIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE Cypress reserves the right to make changes without further notice to the materials described herein Cypress does not assume any...

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