CYNTEC TFP-21-S-140-B Скачать руководство пользователя страница 4

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CYNTEC CO., LTD.

乾坤科技股份有限公司

DOCUMENT : RFB00000

REVISION : A0

PAGE : 4 OF 11

Life Test

Item

Specification

Condition

Vibration

Electrical characteristics shall be
within specification
Without distinct damage in appearance

(1)

Vibration Frequency:10 Hz to 55 Hz

to 10 Hz/min

(2)

Vibration shall be applied in x, y, and

z direction respectively for 2 hours
(total 6 hours)

(3)

Amplitude:1.5 mm

Shock

Electrical characteristics shall be
within specification
Without distinct damage in appearance

(1)

Peak value: 980N

(2)

Duration of pulse: 6ms

(3)

X1,X2,Y1,Y2,Z1,Z2 for

times each

(18 times in total)

Bending Test

Electrical characteristics shall be
within specification
Without distinct damage in appearance

Mount on test board with bend with 3 mm
deflection for 30 seconds

Solder strength 9.8 N minimum

Apply pushing force at 0.5 mm/s until
electrode pads are pealed off or ceramics are
broke

Solderability of
Termination

90% terminations is to be soldered
evenly and continuously.

The entire sample shall be dipped in solder
at 230

℃

for 2

0.5 seconds

JIS C 5102 8.11.1

Unit : mm

Solder

Within ±2mm

Test Board

Component

Pre

ssu

Pressure rod

R230

Amplitude
3mm

Содержание TFP-21-S-140-B

Страница 1: ...11 TFP21 SERIES THIN FILM CHIP COUPLER 1 Part Number TFP 21 S 190 A 1 2 3 4 5 Where 1 TFP Thin Film Coupler 2 Size Two digits of number 21 2 00 1 25 mm 3 Design S Single Band D Dual Band 4 Coupling Value Three digits of number 140 14 0 dB 180 18 0 dB 190 19 0 dB 5 Center Frequency A 897 5M B 1747 5M ...

Страница 2: ...dB 0 40 dB 1 4 3W S 190 A 897 5 r 17 5 MHz 19 0 r 1 5 dB 27 dB 0 40 dB 1 4 3W S 140 B 1747 5 r 37 5 MHz 14 0 r 1 0 dB 27 dB 0 60 dB 1 4 1W S 210 B 1747 5 r 37 5 MHz 21 0 r 1 0 dB 30 dB 0 50 dB 1 4 1W 3 Outline Dimension 4 Operation Temperature 40 to 85 Code Dimensions Code Dimensions L 2 0 0 1 b 0 20 0 1 W 1 25 0 1 e 0 35 0 1 T 0 5 0 1 P 0 65 0 05 a 0 3 0 1 Unit mm Terminal Configuration Terminal ...

Страница 3: ...0000 REVISION A0 PAGE 3 OF 11 5 Measuring Method Line No Item ⓐ ⓑ Terminated in 50Ω Insertion Loss 1 4 3 6 Return Loss 1 4 4 6 Coupling 1 6 3 4 Isolation 1 3 4 6 6 Land Pattern Commended 50Ω 50Ω Network Analyzer HP8753E ⓑ ⓐ Line No A 1 0 B 0 35 C 2 8 P 0 65 Unit mm B P C A ...

Страница 4: ...amage in appearance 1 Peak value 980N 2 Duration of pulse 6ms 3 X1 X2 Y1 Y2 Z1 Z2 for 3 times each 18 times in total Bending Test Electrical characteristics shall be within specification Without distinct damage in appearance Mount on test board with bend with 3 mm deflection for 30 seconds Solder strength 9 8 N minimum Apply pushing force at 0 5 mm s until electrode pads are pealed off or ceramics...

Страница 5: ...at 100 cycle as follows 40 r 3 30minutes o Room temperature 2 3 minutes o 85 r 2 30minutes o Room temperature 2 3 minutes 2 Measuring resistance 1 hour after test Moisture with Load Electrical characteristics shall be within specification Without distinct damage in appearance 1 Environment condition 40 r 2 90 95 RH 2 Load 630mA current 3 Test period 1 5 hour ON o 0 5 hour OFF cycled for total 1 00...

Страница 6: ...Packaging Dimensions Material Paper 8 1 2 Reel Dimensions Direction mark P 0 65 r 0 1 P PITCH 4 0 r 0 1 Chip 0 60 r 0 05 B A P 8 0 r 0 3 3 5 r 0 05 1 75 r 0 1 Carrier cavity Pulling direction Unit mm Sprocket hole 2 0 r 0 05 A 1 65 r 0 2 B 2 4 r 0 2 1 5 0 1 0 0 10 0 r 0 15 Unit mm 12 0 r 1 5 3 0 r 1 0 13 0 r 1 0 20min 178 r 2 0 60 0 r 1 0 ...

Страница 7: ...el speed shall be about 300 mm minute The peel strength of top cover tape shall be between 0 1 to 0 7N 8 3 Quantity per Reel 4000 pieces reel 8 4 Marking The following items shall be marked on the reel 1 Manufactures parts number 2 Quantity 3 Manufacturing date code 4 Manufacturer s name 5 The country of origin 165 180 Top Cover Tape 0 1N 0 7N ...

Страница 8: ...the component may change Do you touch the component with bear hands it may hands that may result in poor soliderability on the components 9 3 Notice for Chip Placer When placing the component on the PCB the component may be stressed and broken by uneven forces from worn out chucking locating claw or the suction nozzle To prevent the component from damage be sure to follow the specification for the...

Страница 9: ...g the component with a soldering iron the following conditions should be met Item Kind of iron Nichrome heater Ceramics heater Soldering iron wattage 30 W 18 W Temperature of iron tip 280 250 z Diameter of iron tip φ3 0 mm max z Do not allow the iron tip to directly touch the ceramic element 10 2 Use rosin type flux or weakly active flux with a chlorine content of 0 2 Wt or less 10 3 Use eutectic ...

Страница 10: ...ic cleaning conditions may change depending on the size of the vessel and size of the PCB Be sure to check when setting the conditions Contact Cyntec regarding conditions other than those stated above 12 Operational Environment Conditions 12 1 The components are designed to work for electronic products under normal environmental conditions ambient temperature humidity and pressure Therefore the co...

Страница 11: ...ife Life supporting device Cardiac defibrillator Artificial dializer etc z Information processing system support computer etc z Another application similar to the above 14 Warning 14 1 It shall be understood that this specification is to warrant the quality of the component solely not being mounted on the circuit of your set The electrical performance of the component may vary depending on the con...

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