A
1.0 - 5.0
C
/s
A’
Ty1 : 160
�
20
C
Ty2 : 180
�
20
C
Ty1 - Ty2 : 120s max
B
1.0 - 5.0
C
/s
B’
Tp : Max 245
C
10s max
Tx : 220
C
or more : 70s max
C
1.0 - 5.0
C
/s
7 Safety Standards
6.2 Automatic Mounting (TYPE: B)
¡
To mount SU series automatically, use the transformer area near
the center of the PCB as a pickup point. To mount SUC series au-
tomatically, use the central area of the case as a pickup point. If
the bottom dead point of a suction nozzle is too low when mount-
ing, excessive force is applied to the transformer, which could
cause damage. Please mount carefully.
Please see the External View for details of the pickup point.
6.3 Soldering Conditions
(1) Reflow Soldering
¡
Fig.6.2 shows conditions for the reflow soldering for SU/SUC
series. Please make sure that the temperatures of pin terminals
+Vin and -Vout shown in Fig.6.2 do not exceed the temperatures
shown in Fig.6.3.
¡
If time or temperature of the reflow soldering goes beyond the
conditions, reliability of internal components may be compromised.
Please use the unit under the recommended reflow conditions.
¡
With this reflow profile, internal solder melts down. When trans-
porting the unit within the reflow oven, please do not give vibration
to the unit.
¡
Please avoid reflow soldering after applying adhesive or coating to
the unit.
¡
You can reflow solder up to 2 times. Do not reflow solder when
the power supply is mounted on the back surface of the PCB be-
cause the unit may drop.
(2) Flow Soldering
: 260
C
15 seconds or less
(3) Soldering Iron
: maximum 360
C
5 seconds or less
6.4 Stress to Pin Terminals
¡
If too much stress is applied to input/output pin terminals of the
power supply, internal connection may come down. If you apply
stress as shown below, please kept it at 19.6N (2kgf) or less verti-
cally.
¡
Input/output pin terminals are soldered to the PCB internally. Do
not pull or bend a lead powerfully.
¡
If it is expected that stress is applied to the input/output pin ter-
minals due to vibration or impact, reduce the stress to the pin
terminals by taking such measures as fixing the unit to the PCB by
silicone rubber, etc.
6.5 Cleaning
¡
If you need to clean the unit, please clean it under the following
conditions.
Cleaning Method: Varnishing, Ultrasonic or Vapor Cleaning
Cleaning agent: IPA (Solvent type)
Cleaning Time: Within total 2 minutes for varnishing, ultrasonic
and vapor cleaning
¡
Please dry the unit sufficiently after cleaning.
¡
If you do ultrasonic cleaning, please keep the ultrasonic output at
15W/ or below.
¡
To apply for a safety standard approval using the power supply,
please meet the following conditions. Please contact us for de-
tails.
¿
Please use the unit as a component of an end device.
¿
The area between the input and the output of the unit is isolated
functionally. Depending upon the input voltage, basic insulation,
dual insulation or enhanced insulation may be needed. In such
case, please take care of it within the structure of your end-device.
Please contact us for details.
On-board type
Instruction Manual
G-42
SU.SUC
On-board type
Instruction Manual
G-43
SU.SUC
Fig.6.4 Strength of Input/Output Pin Terminals
Fig.6.3 Recommend Reflow Soldering Conditions
+Vin
-Vout
Fig.6.2 Temperature Measuring Points when Setting Reflow Soldering Conditions
(View from Above)
(
C
)
time(s)
Ty1
Ty2
Tp
Tx
A
A’
B
B’
C
19.6N(2kgf)
or less
19.6N(2kgf)
or less
19.6N(2kgf)
or less
19.6N(2kgf)
or less
