41
8
+VOUT
+S
-VOUT
+VIN
RC
-VIN
TRM
-S
(f) CHS400/CHS500
41
8
+VOUT
-VOUT
+S
-VOUT
+VOUT
+VIN
RC
-VIN
TRM
-S
(g) CHS700
Dimensions in mm
Fig.6.1 Prohibition area of pattern layout (top view)
6.2 Automatic Mounting (CHS series:option S)
¡
To mount CHS series automatically, use the inductor area near the
output pin as an adsorption point. Please see the External View
for details of the adsorption point.
If the bottom dead point of a suction nozzle is too low when
mounting excessive force is applied to the inductor, it could cause
damage. Please mount carefully.
6.3 Soldering
(1)Flow Soldering :260
C
15 seconds or less
(2)Soldering Iron :maximum 450
C
5 seconds or less
(3)Reflow Soldering (option “-S”)
¡
Fig.6.2 shows conditions for the reflow soldering for option “-S”
of CHS series. Please make sure that the temperatures of pin
terVIN and -VOUT shown in Fig.6.2 do not exceed the
temperatures shown in Fig.6.3.
¡
If time or temperature of the reflow soldering goes beyond the
conditions, reliability of internal components may be compromised.
Please use the unit under the recommended reflow conditions.
+VIN
-VOUT
(a) CHS60
+VIN
-VOUT
(b) CHS80
+VIN
-VOUT
(c) CHS120
Fig.6.2 Temperature Measuring Points when Setting
Reflow Soldering Conditions
C
time(s)
Ty1
Ty2
Tp
Tx
A’
A
B
B'
C
A
1.0 - 5.0
C
/s
A'
Ty1:160±10
C
Ty2:180±10
C
Ty1 - Ty2:120s max
B
1.0 - 5.0
C
/s
B'
Tp:Max245
C
10s max
Tx:220
C
or more:70s max
C
1.0 - 5.0
C
/s
Fig.6.3 Recommend Reflow Soldering Conditions
¿
Notes to use option “-S”
¡
Solder iron or other similar methods are not recommended solder-
ing method for option “-S” because it may not be able to retain
connection reliability between the PCB and the Pins. Solder reflow
is the acceptable mounting system for the option.
¡
Option “-S” is not reusable product after soldered on any applica-
tion PCB.
CHS-37
DC-DC Converters Bus Converter.Power Module Type
Instruction Manual
