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6.1.4
Gigabit Ethernet
The conga-TS170 is equipped with a Gigabit Ethernet Controller that is integrated within the Intel
®
100 Series PCH This controller is routed to
the onboard Intel
®
i219-LM Phy. The Ethernet interface consists of 4 pairs of low voltage differential pair signals designated from GBE0_MD0±
to GBE0_MD3± plus control signals for link activity indicators. These signals can be used to connect to a 10/100/1000 BaseT RJ45 connector
with integrated or external isolation magnetics on the carrier board.
Note
The GBE0_LINK# output is only active during a 100Mbit or 1Gbit connection. It is not active during a 10Mbit connection. This is a limitation of
Ethernet Phy since it only has 3 LED outputs, ACT#, LINK100# and LINK1000#. The GBE0_LINK# signal is a logic AND of the GBE0_LINK100#
and GBE0_LINK1000# signals on the conga-TS170 module.
6.1.5
LPC Bus
The conga-TS170 offers the LPC (Low Pin Count) bus through the Intel
®
100 Series PCH. There are many devices available for this Intel
®
defined
bus. The LPC bus corresponds approximately to a serialized ISA bus yet with a significantly reduced number of signals. Due to the software
compatibility to the ISA bus, I/O extensions such as additional serial ports can be easily implemented on an application specific baseboard
using this bus. See section 9.1.1 for more information about the LPC Bus.
6.1.6
I²C Bus Fast Mode
The I²C bus is implemented through the congatec board controller (Texas Instruments Tiva™ TM4E1231H6ZRB) and accessed through the
congatec CGOS driver and API. The controller provides a Fast Mode multi-master I²C host controller that has maximum I²C bandwidth.
6.1.7
PCI Express™
The conga-TS170 offers six PCI Express™ lanes on the A-B connector and two lanes on the CD connector. The lanes are based on PCI Express
Specification 3.0 with up to 8 GT/s (Gen 3) speed.
Default configuration for the PCIe lanes on the conga-TS170 is 8 x1 links. Other combinations are possible but would require a special/
customized BIOS firmware. Contact congatec technical support for more information about this subject.
For more information, see section 6.2.1.