Copyright
©
2018
congatec
AG
TR44m17
20/65
4
Cooling Solutions
congatec AG offers the cooling solutions listed in Table 9 for conga-TR4. The dimensions of the cooling solutions are shown in the sub-sections.
All measurements are in millimeters.
Table 9
Cooling Solution Variants
Cooling Solution
Part No Description
1
HSP
041651
Heatspreader with 2.7 mm bore-hole standoffs.
041652
Heatspreader with M2.5 mm threaded standoffs.
2
CSP
041653
Passive cooling with 2.7 mm bore-hole standoffs.
041654
Passive cooling with M2.5 mm threaded standoffs.
3
CSA
048555
Active cooling with 2.7 mm bore-hole standoffs.
048556
Active cooling with M2.5 mm threaded standoffs.
Note
1. We recommend a maximum torque of 0.4 Nm for carrier board mounting screws and 0.5 Nm for module mounting screws.
2. The gap pad material used on congatec heatspreaders may contain silicon oil that can seep out over time depending on the environmental
conditions it is subjected to. For more information about this subject, contact your local congatec sales representative and request the gap
pad material manufacturer’s specification.
Caution
1. The congatec heatspreaders/cooling solutions are tested only within the commercial temperature range of 0° to 60°C. Therefore, if your
application that features a congatec heatspreader/cooling solution operates outside this temperature range, ensure the correct operating
temperature of the module is maintained at all times. This may require additional cooling components for your final application’s thermal
solution.
2. For adequate heat dissipation, use the mounting holes on the cooling solution to attach it to the module. Apply thread-locking fluid on
the screws if the cooling solution is used in a high shock and/or vibration environment. To prevent the standoff from stripping or cross-
threading, use non-threaded carrier board standoffs to mount threaded cooling solutions.
3. For applications that require vertically-mounted cooling solution, use only coolers that secure the thermal stacks with fixing post. Without
the fixing post feature, the thermal stacks may move.
