Cinterion EES3, Описание аппаратного интерфейса

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EES3 Hardware Interface Description
5.5 Pad Assignment and Signal Description
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EES3_HD_v01.100b Page 80 of 118 2009-08-12
Confidential / Released
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5.5 Pad Assignment and Signal Description
The SMT application interface on the EES3 provides connecting pads to integrate the module
into external applications.
Figure 41 shows the connecting pads’ numbering plan, the following
Table 26 lists the pads’ assignments.
Figure 41:
Numbering plan for connecting pads (bottom view)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
41
42
43
37
38
39
40
45
46
47
51
52
53
57
58
59
48
49
50
54
55
56
60
61
62
63
64
65
69
70
71
75
76
77
66
67
68
72
73
74
80
81
82
85
86
87
88
89
90
91
92
93
94
98
99
100
101
102
103
104
105
106
107
109
110
111
112
113
114
115
116
117
118
83
84 97
95
96
108
78
79
119
44
Supply pads
Control pads
GND pads
Analog audio pads
ASC0 pads
ASC1 pads
SIM pads
Other interface pads
RF antenna pad
Do not use