1.3 C
AUTIONS FOR
D
ISASSEMBLY AND
R
EASSEMBLY
• After removing the top cover unit, do not apply pressure against the flexible boards.
• Before disassembly, see how the lead wires are routed.
• As a general rule, reassemble by following the disassembly procedure in reverse.
• During the procedure, take adequate measures against static charge.
• When using the service battery, be sure to note the positive and negative contacts.
1.4 O
PERATION IN
N
O
T
OP
C
OVER
A
SS
’
Y
S
TATE
Operation check after disassembling is possible in no Top Cover Ass’y state.
• Camera mode: Full-auto
• be stop condition: Slower shutter speed than 1/125 second.
1.5 T
EMPORARY
T
REATMENT FOR
T
OP
C
OVER
A
SS
’
Y AND
BP FPC S
ECTION
For a temporary countermeasure against malfunction of the mode dial, the small flex
(Fig. 3-3) or the PCB with a capacitor (Fig. 3-4) has been installed at the back of the
Mode Dial (command dial PCB) in the Front Cover Ass’y. The service part Top Cover
Ass’y has either of those parts.
For a temporary countermeasure for malfunction of the back cover release latch, a
capacitor has been installed to the soldered portion on the BP flex. If the capacitor is
removed for the DX flex or BP flex replacement, resolder it as it was.
Above two countermeasure are related with the DSP PCB Ass’y, and they will no longer
used if the DSP PCB Ass’y is changed to the new type.
The infomation about permanent countermeasure will be announced in Service Manual
Report when they are taken.
Part 3: Repair Information
3-2
Fig. 3-3 Small flex
Fig. 3-4 Dial board
Small flex
Fig. 3-5 BP FPC
Capacitor
BP FPC
Dial board
(The board shown in Fig. 3-3 is the normal one.)
Содержание EOS EOS 7
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